SCHEMBL30457249

SCHEMBL30457249

CCCCC(CC)COC(=O)OOOC(C)(C)CCCC

nearest known ligand 0.49

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 5/20 0.49
TSHR P16473 3/20 0.49
TDP1 Q9NUW8 2/20 0.49
ATM Q13315 1/20 0.49
ALDH1A1 P00352 6/20 0.44
CA2 P00918 5/20 0.44
RECQL P46063 1/20 0.42
LMNA P02545 3/20 0.40
MAPK1 P28482 3/20 0.40
HSD17B10 Q99714 1/20 0.40
PRSS1 P07477 1/20 0.39
PRSS2 P07478 1/20 0.39
PRSS3 P35030 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
CA1 P00915 2/20 0.36
MMP9 P14780 1/20 0.35
MMP8 P22894 1/20 0.35
MMP14 P50281 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8428242 0.95 CYP3A4 (0.49) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL28800928 0.92 CYP3A4 (0.47) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL137584 0.90 CYP3A4 (0.50) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL22799161 0.88 CYP3A4 (0.48) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL10581255 0.88 CYP3A4 (0.50) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL82417 0.87 CYP3A4 (0.53) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL28772 0.87 CYP3A4 (0.53) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL21900161 0.87 CYP3A4 (0.47) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL22733766 0.86 CYP3A4 (0.49) CYP3A4TSHRTDP1ATMALDH1A1
SCHEMBL27338212 0.86 CYP3A4 (0.51) CYP3A4TSHRTDP1ATMALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025075120-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075123-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075152-A1 GRANULAR BODY, METHOD FOR PRODUCING SAME, AND THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075122-A1 CROSSLINKED RESIN PARTICLES AND THERMOPLASTIC RESIN MODIFIER 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075121-A1 CROSS-LINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075118-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075124-A1 MOLDED FILM OR MOLDED SHEET 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075116-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075117-A1 THERMOPLASTIC RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2025-04-10 WO disclosed
WO-2025075125-A1 BLOW-MOLDED ARTICLE AND METHOD FOR PRODUCING SAME 株式会社カネカ 2025-04-10 WO disclosed
WO-2024203745-A1 RESIN POWDER AND METHOD FOR PRODUCING SAME 株式会社カネカ 2024-10-03 WO disclosed
WO-2024090484-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2024-05-02 WO disclosed
US-20230323114-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF KANEKA CORPORATION (JP) 2023-10-12 US disclosed
WO-2023190185-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190184-A1 THERMOPLASTIC RESIN COMPOSITION 株式会社カネカ 2023-10-05 WO disclosed
WO-2023190183-A1 CROSSLINKED RESIN PARTICLES AND METHOD FOR PRODUCING SAME 株式会社カネカ 2023-10-05 WO disclosed
EP-4183828-A1 ALIPHATIC-POLYESTER-BASED RESIN COMPOSITION AND UTILIZATION THEREOF Kaneka Corporation (JP) 2023-05-24 EP disclosed