SCHEMBL305685

SCHEMBL305685

[Ni].[P].[Re]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3171641 0.87
SCHEMBL306413 0.87
SCHEMBL7464504 0.87
SCHEMBL438832 0.87
SCHEMBL7456362 0.87
SCHEMBL5807068 0.82
SCHEMBL7673392 0.82
SCHEMBL3348950 0.82
SCHEMBL108727 0.82
SCHEMBL7104002 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8784931-B2 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY (JP) 2014-07-22 US claimed
US-20100006326-A1 ULSI WIRING AND METHOD OF MANUFACTURING THE SAME NEC ELECTRONICS CORPORATION (JP) 2010-01-14 US claimed
CN-100408202-C Electroless plating solution and process MATTSON TECH INC (US) 2008-08-06 CN claimed
CN-1761534-A Electroless plating solution and method MATTSON TECH INC (US) 2006-04-19 CN claimed
US-6797312-B2 DOES NOT REQUIRE THE USE OF A CATALYST, COMPRISING A FIRST REDUCING AGENT, A SECOND REDUCING AGENT, A PH ADJUSTING AGENT, A FIRST METAL SOURCE, AND A SECOND METAL SOURCE MATTSON TECHNOLOGY, INC. 2004-09-28 US claimed
WO-2004067192-A1 ELECTROLESS PLATING SOLUTION AND PROCESS MATTSON TECHNOLOGY, INC. (US) 2004-08-12 WO claimed
US-20040142114-A1 Electroless plating solution and process MATTSON TECHNOLOGY, INC. 2004-07-22 US claimed
US-20040126548-A1 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY 2004-07-01 US claimed
US-20030124255-A1 ULSI wiring and method of manufacturing the same NEC CORPORATION 2003-07-03 US claimed
US-20030124263-A1 ULSI wiring and method of manufacturing the same NEC CORPORATION 2003-07-03 US claimed
US-20030008075-A1 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY, NEC CORPORATION 2003-01-09 US claimed
US-12017297-B2 Method for manufacturing metal matrix composite parts SPIRIT AEROSYSTEMS, INC. (US) 2024-06-25 US disclosed
EP-4202073-A1 METHOD FOR MANUFACTURING METAL MATRIX COMPOSITE PARTS Spirit AeroSystems, Inc. (US) 2023-06-28 EP disclosed
US-20230191528-A1 METHOD FOR MANUFACTURING METAL MATRIX COMPOSITE PARTS SPIRIT AEROSYSTEMS, INC. (US) 2023-06-22 US disclosed
US-8784931-B2 ULSI wiring and method of manufacturing the same WASEDA UNIVERSITY (JP) 2014-07-22 US disclosed
US-20020096207-A1 Photovoltaic panel and method of producing same FUJI MACHINE MFG. CO., LTD. 2002-07-25 US disclosed
US-6399412-B1 Photovoltaic panel and method of producing same FUJI MACHINE MFG. CO., LTD. (JP) 2002-06-04 US disclosed
EP-1102332-A2 Photovoltaic panel and method of producing same FUJI MACHINE Mfg. Co., Ltd. (JP) 2001-05-23 EP disclosed
WO-1996030130-A1 PROCESS AND EQUIPMENT FOR REFORMING AND MAINTAINING ELECTROLESS METAL BATHS VAUGHAN DANIEL J (US) 1996-10-03 WO disclosed
US-5419821-A Process and equipment for reforming and maintaining electroless metal baths VAUGHAN DANIEL J (US) 1995-05-30 US disclosed