⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1404391 | 0.67 | — | — | |
| SCHEMBL1922711 | 0.56 | — | — | |
| SCHEMBL1922712 | 0.56 | — | — | |
| SCHEMBL45844 | 0.53 | — | — | |
| SCHEMBL3079568 | 0.53 | — | — | |
| SCHEMBL11766933 | 0.53 | — | — | |
| SCHEMBL1230809 | 0.52 | — | — | |
| SCHEMBL20367512 | 0.51 | — | — | |
| SCHEMBL12328032 | 0.51 | — | — | |
| SCHEMBL8445451 | 0.50 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114478970-B | Precursor composition of covalent organic framework material and application thereof | 中国科学院大连化学物理研究所 | 2023-11-03 | — | — | CN | claimed |
| CN-114478970-A | Precursor composition of covalent organic framework material and application thereof | 中国科学院大连化学物理研究所 | 2022-05-13 | — | — | CN | claimed |
| CN-114478970-B | Precursor composition of covalent organic framework material and application thereof | 中国科学院大连化学物理研究所 | 2023-11-03 | — | — | CN | disclosed |
| CN-114478970-A | Precursor composition of covalent organic framework material and application thereof | 中国科学院大连化学物理研究所 | 2022-05-13 | — | — | CN | disclosed |
| CN-112978709-A | Carbon quantum dot precursor composition, carbon quantum dot and preparation method thereof | 中国科学院大连化学物理研究所 | 2021-06-18 | — | — | CN | disclosed |
| US-9812315-B2 | Treating solution for electronic parts, and process for producing electronic parts | FINE POLYMERS CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-9812315-B2 | Treating solution for electronic parts, and process for producing electronic parts | FINE POLYMERS CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-9812315-B2 | Treating solution for electronic parts, and process for producing electronic parts | FINE POLYMERS CORPORATION (JP) | 2017-11-07 | — | — | US | disclosed |
| US-20150279654-A1 | TREATING SOLUTION FOR ELECTRONIC PARTS, AND PROCESS FOR PRODUCING ELECTRONIC PARTS | FINE POLYMERS CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-20150279654-A1 | TREATING SOLUTION FOR ELECTRONIC PARTS, AND PROCESS FOR PRODUCING ELECTRONIC PARTS | FINE POLYMERS CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-20150279654-A1 | TREATING SOLUTION FOR ELECTRONIC PARTS, AND PROCESS FOR PRODUCING ELECTRONIC PARTS | FINE POLYMERS CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-20040011252-A1 | Non-toxic corrosion-protection pigments based on manganese | UNIVERSITY OF DAYTON | 2004-01-22 | — | — | US | disclosed |
| US-20030234063-A1 | Non-toxic corrosion-protection conversion coats based on cobalt | DAYTON, UNIVERSITY OF | 2003-12-25 | — | — | US | disclosed |
| US-20030230363-A1 | Non-toxic corrosion-protection rinses and seals based on cobalt | UNIVERSITY OF DAYTON | 2003-12-18 | — | — | US | disclosed |
| WO-2003060191-A2 | NON-TOXIC CORROSION-PROTECTION CONVERSION COATINGES ABSED ON COBALT | UNIVERSITY OF DAYTON (US) | 2003-07-24 | — | — | WO | disclosed |
| WO-2003060192-A1 | NON-TOXIC CORROSION-PROTECTION RINSES AND SEALS BASED ON COBALT | UNIVERSITY OF DAYTON (US) | 2003-07-24 | — | — | WO | disclosed |
| WO-2003060019-A1 | NON-TOXIC CORROSION PROTECTION PIGMENTS BASED ON COBALT | UNIVERSITY OF DAYTON (US) | 2003-07-24 | — | — | WO | disclosed |
| EP-0614915-B1 | Polymer scale preventive agent | SHINETSU CHEMICAL CO (JP) | 1998-06-24 | — | — | EP | disclosed |
| US-5420214-A | Process to prevent scale adhesion using condensation product of a diamino heterocyclic and a quinone | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 1995-05-30 | — | — | US | disclosed |
| EP-0614915-A1 | Polymer scale preventive agent | Shin-Etsu Chemical Co., Ltd. (JP) | 1994-09-14 | — | — | EP | disclosed |