⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30697203 | 1.00 | — | — | |
| SCHEMBL29350051 | 0.87 | — | — | |
| SCHEMBL6575476 | 0.87 | — | — | |
| SCHEMBL29779513 | 0.82 | — | — | |
| SCHEMBL29875712 | 0.82 | — | — | |
| SCHEMBL29352138 | 0.82 | — | — | |
| SCHEMBL29350475 | 0.82 | — | — | |
| SCHEMBL2254018 | 0.82 | — | — | |
| SCHEMBL708004 | 0.82 | — | — | |
| SCHEMBL31330335 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230326899-A1 | DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE | QORVO US, INC. | 2023-10-12 | — | — | US | claimed |
| EP-4698686-A1 | PLATINUM ALLOY | Argor-Heraeus S.A. (CH) | 2026-02-25 | — | — | EP | disclosed |
| WO-2024218583-A1 | PLATINUM ALLOY | ARGOR - HERAEUS SA (CH) | 2024-10-24 | — | — | WO | disclosed |
| US-20230326899-A1 | DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRONICS PACKAGE | QORVO US, INC. | 2023-10-12 | — | — | US | disclosed |