SCHEMBL30853601

SCHEMBL30853601

CC(C)(C)OOOOOOC(C)(C)C#CC(C)(C)OOOOOOC(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.39
TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2811713 0.80 TSHR (0.58) TSHRTDP1
SCHEMBL1684315 0.80 TSHR (0.58) TSHRTDP1
SCHEMBL6831702 0.78 TSHR (0.57) TSHRTDP1
SCHEMBL24779 0.78 TSHR (0.57) TSHRTDP1
SCHEMBL1723918 0.77 TSHR (0.64) TSHRTDP1
Hydrogen Peroxide SCHEMBL8160919 0.73 TSHR (0.50) TSHRTDP1
SCHEMBL1702215 0.69 TSHR (0.64) TSHRTDP1
SCHEMBL14380152 0.69 TSHR (0.44) TSHRTDP1
SCHEMBL39439 0.69 TSHR (0.44) TSHRTDP1
SCHEMBL29771759 0.67 TSHR (0.42) TSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3786233-B1 RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-04-23 EP claimed
US-11924979-B2 Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-03-05 US claimed