SCHEMBL309289

SCHEMBL309289

CC(c1ccc(Oc2cccc(N)c2)cc1)c1ccc(Oc2cccc(N)c2)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.63
ALDH1A1 P00352 5/20 0.57
SMN1; SMN2 Q16637 2/20 0.55
MAPT P10636 2/20 0.55
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
MITF O75030 1/20 0.55
GAA P10253 1/20 0.55
GFER P55789 1/20 0.55
NLRP1 Q9C000 1/20 0.55
NOD2 Q9HC29 1/20 0.55
CYP3A4 P08684 3/20 0.50
ATM Q13315 1/20 0.47
POLB P06746 1/20 0.47
HSP90AA1 P07900 1/20 0.47
TP53 P04637 1/20 0.46
LTA4H P09960 1/20 0.46
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
NLRP3 Q96P20 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29363383 1.00 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL16678937 0.91 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL10476052 0.91 MAOB (0.53) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL7858687 0.89 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL15474288 0.89 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL31563609 0.89 MAOB (0.63) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL29352463 0.84 MAOB (0.86) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL204267 0.84 MAOB (0.86) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL29363390 0.84 MAOB (0.86) MAOBALDH1A1SMN1; SMN2MAPTMEN1
SCHEMBL128748 0.84 MAOB (0.86) MAOBALDH1A1SMN1; SMN2MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 498 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7803896-B2 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2010-09-28 US claimed
US-20090092759-A1 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2009-04-09 US claimed
US-5278276-A Polyamic acid precursor; prepared from bis/aminophenoxyphenyl/ compounds and tetracarboxylic acid dianhydrides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-01-11 US claimed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
WO-2025047667-A1 SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL 東洋紡株式会社 2025-03-06 WO disclosed
US-20250019508-A1 LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT TOYOBO CO., LTD. (JP) 2025-01-16 US disclosed
WO-2024262187-A1 RESIN FILM, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METHOD FOR PRODUCING RESIN FILM 東洋紡株式会社 2024-12-26 WO disclosed
US-12172409-B2 Laminate of inorganic substrate/polymer film layer with attached protective film, laminate stack, laminate storage method, and laminate transport method TOYOBO CO., LTD. (JP) 2024-12-24 US disclosed
US-20240395547-A1 SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS UNIVERSITY OF TSUKUBA (JP) 2024-11-28 US disclosed
EP-0294195-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
EP-0294144-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
EP-0292243-A2 Heat resistant resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-11-23 EP disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0269319-A2 Polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-06-01 EP disclosed
EP-0267289-A1 POLYIMIDE RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-05-18 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed
EP-0251741-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-07 EP disclosed
EP-0235294-A1 POLYIMIDES AND HEAT-RESISTANT ADHESIVES COMPRISING THE SAME MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-09-09 EP disclosed