Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PPARG | P37231 | 2/20 | 0.36 |
| ▸ | FABP3 | P05413 | 8/20 | 0.35 |
| ▸ | FABP7 | O15540 | 7/20 | 0.35 |
| ▸ | FABP5 | Q01469 | 6/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | P4HB | P07237 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29963300 | 0.92 | MEN1 (0.37) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL30945752 | 0.92 | MEN1 (0.37) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL28894512 | 0.92 | FABP3 (0.37) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL29963221 | 0.91 | PPARG (0.36) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL29962785 | 0.88 | KDM4E (0.31) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL29963314 | 0.88 | PPARG (0.31) | PPARGALDH1A1MEN1KMT2ASMN1; SMN2 | |
| SCHEMBL29963398 | 0.88 | MEN1 (0.35) | PPARGALDH1A1MEN1KMT2ASMN1; SMN2 | |
| SCHEMBL30945757 | 0.88 | MEN1 (0.35) | PPARGALDH1A1MEN1KMT2ASMN1; SMN2 | |
| SCHEMBL29232030 | 0.88 | FABP3 (0.35) | PPARGFABP3FABP7FABP5ALDH1A1 | |
| SCHEMBL29963191 | 0.88 | PPARG (0.31) | PPARGALDH1A1MEN1KMT2ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115380075-B | Epoxy resin composition for sealing semiconductor | 纳美仕有限公司 | 2024-06-18 | — | — | CN | disclosed |