SCHEMBL309467

SCHEMBL309467

Nc1ccc(NC(=O)c2cccc(N)c2)cc1

nearest known ligand 0.72

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 5/20 0.72
MEN1 O00255 4/20 0.67
KMT2A Q03164 4/20 0.67
LMNA P02545 1/20 0.67
POLB P06746 1/20 0.67
PKM P14618 1/20 0.67
APEX1 P27695 1/20 0.67
TDP1 Q9NUW8 1/20 0.67
SMN1; SMN2 Q16637 1/20 0.64
NPSR1 Q6W5P4 1/20 0.64
HSD17B10 Q99714 1/20 0.64
SNCA P37840 1/20 0.60
ULK1 O75385 1/20 0.59
TP53 P04637 1/20 0.59
PRMT1 Q99873 1/20 0.58
KDM4C Q9H3R0 1/20 0.58
KDM4E B2RXH2 1/20 0.58
ALDH1A1 P00352 1/20 0.58
MAPT P10636 1/20 0.57
HDAC3 O15379 1/20 0.56

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31171945 1.00 PTGS1 (0.72) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL17744815 0.97 KMT2A (0.73) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL2127722 0.96 PTGS1 (0.77) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL6082893 0.93 MEN1 (0.71) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL22826277 0.92 PTGS1 (0.65) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL11593046 0.91 PTGS1 (0.75) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL1352405 0.89 PTGS1 (0.68) PTGS1MEN1KMT2ALMNAPOLB
SCHEMBL7234099 0.88 PTGS1 (0.67) PTGS1MEN1KMT2ALMNASMN1; SMN2
SCHEMBL7235873 0.88 TP53 (0.78) PTGS1MEN1KMT2ASMN1; SMN2NPSR1
SCHEMBL7234934 0.88 PTGS1 (0.67) PTGS1MEN1KMT2ALMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 472 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111770949-B Polyimide, polyimide solution composition, polyimide film, and substrate UBE株式会社 2024-01-16 CN claimed
CN-115863528-A Negative electrode slurry for secondary battery and preparation method thereof 桂林电器科学研究院有限公司 2023-03-28 CN claimed
CN-110515269-B Photosensitive resin composition and preparation method thereof, polymer film and copper-clad plate 臻鼎科技股份有限公司 2022-12-20 CN claimed
EP-3878889-A1 POLYAMIDEIMIDES FOR ADDITIVE MANUFACTURING Henkel AG & Co. KGaA (DE) 2021-09-15 EP claimed
US-10928730-B2 Photosensitive resin composition, and polymer film made therefrom Zhen Ding Technology Co., Ltd. (TW) 2021-02-23 US claimed
CN-106916306-B Resin composition, and insulating substrate and circuit board comprising same 张绮兰 2020-11-17 CN claimed
EP-1141163-A1 POLYAMIDEIMIDESILOXANE HOT MELT ADHESIVE Sumitomo Bakelite Company Limited (JP) 2001-10-10 EP claimed
US-6156820-A Polyamideimidesiloxane hot melt adhesive OCCIDENTAL CHEMICAL CORPORATION (US) 2000-12-05 US claimed
WO-2000039236-A1 POLYAMIDEIMIDESILOXANE HOT MELT ADHESIVE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2000-07-06 WO claimed
US-5478914-A Polyimides and processes for preparaing the same SHIN-ETSU CHEMICAL CO., LTD. (JP) 1995-12-26 US claimed
US-4736015-A FROM DI-(ORTETRA) ESTER OF BENZHYDROL 3,3*,4,4*-TETRACARBOXYLIC ACID AND AROMATIC DIAMINE INSTITUT FRANCAIS DU PETROLE (FR) 1988-04-05 US claimed
EP-0082724-B1 A POLYAMIDE ACID, A PROCESS FOR ITS PRODUCTION AND A POLYIMIDE PRODUCED THEREFROM JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1985-08-28 EP claimed
US-4499042-A Production of heat-shrinkable polyimide films NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1985-02-12 US claimed
US-4454310-A Polyamide acid, process for producing same and polyimide obtained therefrom JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1984-06-12 US claimed
EP-0082724-A1 A polyamide acid, a process for its production and a polyimide produced therefrom JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1983-06-29 EP claimed
US-4347286-A Heat fusible polyimide compound films and process for producing the same NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) 1982-08-31 US claimed
US-4018742-A Imide-ring containing polyester and wire enamel containing same NITTO ELECTRIC INDUSTRIAL CO., LTD. (JA) 1977-04-19 US claimed
US-3975330-A Imide-modified polyester resin and wire enamel containing the imide-modified polyester resin NITTO ELECTRIC INDUSTRIAL CO., LTD. (JA) 1976-08-17 US claimed
JP-3275724-A None JP disclosed
US-3936404-A Aqueous baking varnishes from carboxylic polyester and carboxylic polyimide, and coated article NITTO ELECTRIC INDUSTRIAL CO., LTD. (JA) 1976-02-03 US disclosed