Vinyl Ether

Vinyl Ether

SCHEMBL3102249

C=COC=C.CO

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Vinyl Ether SCHEMBL27427162 1.00
Vinyl Ether SCHEMBL2904125 0.89
Cyclohexane SCHEMBL36893 0.89
Cyclohexane SCHEMBL3165687 0.89
Vinyl Ether SCHEMBL1468848 0.89
Vinyl Ether SCHEMBL2905334 0.89
Vinyl Ether SCHEMBL19363 0.85
Vinyl Ether SCHEMBL477946 0.85
Vinyl Ether SCHEMBL45739 0.84
Vinyl Ether SCHEMBL15940293 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024024501-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION 日産化学株式会社 2024-02-01 WO claimed
CN-109867756-A A kind of 3 D-printing blue light curing photosensitive resin and preparation method thereof 苏州轻金三维科技有限公司 2019-06-11 CN claimed
CN-107710077-A RECORDED MATTER AND IMAGE FORMING METHOD 佳能株式会社 2018-02-16 CN claimed
CN-107357136-A Photosensitive liquid resin 广西众昌树脂有限公司 2017-11-17 CN claimed
WO-2024135086-A1 PHOTOCURABLE COMPOSITION, UNDERCOAT LAYER, LAMINATE AND DISPLAY DEVICE 株式会社ダイセル 2024-06-27 WO disclosed
WO-2024071139-A1 MULTILAYER STRUCTURE AND METHOD FOR PRODUCING SAME, AUTOMOBILE PART, AIRCRAFT PART, AND DAMPING MATERIAL FOR CARBON-FIBER-REINFORCED PLASTIC 三菱ケミカル株式会社 2024-04-04 WO disclosed
WO-2023140036-A1 SILICONE CHAIN-CONTAINING POLYMER, METHOD FOR PRODUCING SILICONE CHAIN-CONTAINING POLYMER, COATING COMPOSITION, RESIST COMPOSITION, AND ARTICLE DIC株式会社 2023-07-27 WO disclosed
US-20210402748-A1 FREE RADICAL POLYMERIZABLE ADHESION-PROMOTING INTERLAYER COMPOSITIONS AND METHODS OF USE PRC DESOTO INT INC (US) 2021-12-30 US disclosed
WO-2020130016-A1 ACTIVE ENERGY RAY-CURABLE FLEXOGRAPHIC PRINTING INK COMPOSITION サカタインクス株式会社 2020-06-25 WO disclosed
CN-110358040-A A kind of photocureable rapid shaping photosensitive resin composition 岭南师范学院 2019-10-22 CN disclosed
CN-109160998-B A kind of binary mercaptan oligomer and its preparation method and application 岭南师范学院 2019-09-10 CN disclosed
CN-108892763-B Polyurethane dithiol prepolymer, photosensitive resin composition, and preparation methods and applications thereof 岭南师范学院 2019-08-30 CN disclosed
US-8728662-B2 Process for producing polyradical compound and battery cell NEC CORPORATION (JP) 2014-05-20 US disclosed
US-20100255372-A1 PROCESS FOR PRODUCING POLYRADICAL COMPOUND AND BATTERY CELL NEC CORPORATION (JP) 2010-10-07 US disclosed
CN-101668816-A Thermosetting resin composition and optical member using cured product of the thermosetting resin composition HITACHI CHEMICAL CO LTD 2010-03-10 CN disclosed
WO-2009132023-A2 PHOTOSENSITIVE HARDMASK FOR MICROLITHOGRAPHY BREWER SCIENCE INC. (US) 2009-10-29 WO disclosed
EP-2025689-A1 PROCESS FOR PRODUCTION OF POLYRADICAL COMPOUND AND BATTERY CELL NEC Corporation (JP) 2009-02-18 EP disclosed
CN-100355803-C Amorphous polyesters as polymer matrices for chewing gum matrices BASF AG (DE) 2007-12-19 CN disclosed
CN-1798788-A Amorphous polyesters as polymer matrices for chewing gum matrices BASF AG (DE) 2006-07-05 CN disclosed
US-4546157-A TETRAFLUOROETHYLENE, HEXAFLUOROPROPENE, AND A PERFLUOROVINYL ETHER DAIKIN KOGYO CO., LTD. (JP) 1985-10-08 US disclosed