⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30417999 | 0.88 | — | — | |
| SCHEMBL29149656 | 0.83 | — | — | |
| SCHEMBL29045151 | 0.75 | — | — | |
| SCHEMBL30577341 | 0.75 | — | — | |
| SCHEMBL28933359 | 0.72 | — | — | |
| SCHEMBL6743840 | 0.72 | HTT (0.31) | — | |
| SCHEMBL28990100 | 0.71 | — | — | |
| SCHEMBL9080101 | 0.71 | — | — | |
| SCHEMBL8468603 | 0.71 | — | — | |
| SCHEMBL29094006 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118984843-A | Copolymer, molded body, and injection-molded body | 大金工业株式会社 | 2024-11-19 | — | — | CN | disclosed |
| CN-118974111-A | Copolymer, molded article, extrusion molded article, and transfer molded article | 大金工业株式会社 | 2024-11-15 | — | — | CN | disclosed |
| CN-118946605-A | Copolymer, molded body, and injection-molded body | 大金工业株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118946598-A | Copolymer, molded body, and injection-molded body | 大金工业株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118946604-A | Copolymer, molded article, extrusion molded article, and transfer molded article | 大金工业株式会社 | 2024-11-12 | — | — | CN | disclosed |
| CN-118900859-A | Copolymer, molded body, and injection-molded body | 大金工业株式会社 | 2024-11-05 | — | — | CN | disclosed |
| CN-118900904-A | Powder coating, film coating and article | 大金工业株式会社 | 2024-11-05 | — | — | CN | disclosed |