⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Magnesium SCHEMBL29350974 | 1.00 | — | — | |
| Magnesium SCHEMBL31303336 | 0.82 | — | — | |
| Magnesium SCHEMBL31072236 | 0.82 | — | — | |
| Magnesium SCHEMBL31303344 | 0.82 | — | — | |
| Magnesium SCHEMBL7060934 | 0.82 | — | — | |
| Magnesium SCHEMBL31522384 | 0.82 | — | — | |
| Magnesium SCHEMBL31196463 | 0.82 | — | — | |
| Magnesium SCHEMBL7060936 | 0.82 | — | — | |
| Magnesium SCHEMBL31468732 | 0.82 | — | — | |
| Magnesium SCHEMBL31522385 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260023419-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECH CO LTD (CN) | 2026-01-22 | — | — | US | claimed |
| EP-4629765-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | Huawei Technologies Co., Ltd. (CN) | 2025-10-08 | — | — | EP | claimed |
| WO-2024188003-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | 华为技术有限公司 | 2024-09-19 | — | — | WO | claimed |
| US-20260023419-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECH CO LTD (CN) | 2026-01-22 | — | — | US | disclosed |
| EP-4629765-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | Huawei Technologies Co., Ltd. (CN) | 2025-10-08 | — | — | EP | disclosed |
| WO-2024188003-A1 | HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE | 华为技术有限公司 | 2024-09-19 | — | — | WO | disclosed |