SCHEMBL3133115

SCHEMBL3133115

Cc1[nH]c(-c2ccccc2)nc1-c1ccc(Cl)cc1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPY5R Q15761 4/20 0.71
HPGDS O60760 1/20 0.60
MAPK13 O15264 5/20 0.60
MAPK12 P53778 5/20 0.60
MAPK11 Q15759 5/20 0.60
MAPK14 Q16539 5/20 0.60
RAF1 P04049 1/20 0.60
GCGR P47871 4/20 0.58
POLB P06746 1/20 0.57
SMPD3 Q9NY59 1/20 0.54
GAA P10253 2/20 0.51
KDM4E B2RXH2 1/20 0.51
LMNA P02545 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51
MGAM O43451 1/20 0.49
SI P14410 1/20 0.49
MGAM2 Q2M2H8 1/20 0.49
TNKS O95271 1/20 0.49
GUSB P08236 1/20 0.49
TNKS2 Q9H2K2 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3141271 1.00 NPY5R (0.71) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL31305589 0.90 NPY5R (0.68) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL724250 0.89 NPY5R (0.72) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL7142762 0.86 NPY5R (0.64) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL3130553 0.85 SMPD3 (0.59) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL3130858 0.85 MAPK13 (0.61) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL2945617 0.84 NPY5R (0.60) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL17810816 0.84 NPY5R (0.56) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL26110146 0.84 NPY5R (0.72) NPY5RHPGDSMAPK13MAPK12MAPK11
SCHEMBL27762179 0.84 NPY5R (0.68) NPY5RHPGDSMAPK13MAPK12MAPK11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
CN-101448978-B Surface treating agent for metal and use thereof SHIKOKU CHEM 2012-06-13 CN disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
CN-1761773-B Novel imidazole compound and usage thereof SHIKOKU CHEM 2010-05-05 CN disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
CN-101448978-A Surface treating agent for metal and use thereof SHIKOKU CHEM (JP) 2009-06-03 CN disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
CN-1761773-A Novel imidazole compound and usage thereof SHIKOKU CHEM (JP) 2006-04-19 CN disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed