SCHEMBL31429613

SCHEMBL31429613

Oc1c(-c2nc(-c3ccccc3)c(-c3ccccc3)[nH]2)ccc2ccccc12

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGAM O43451 1/20 0.62
POLB P06746 2/20 0.58
KDM4E B2RXH2 1/20 0.58
NT5E P21589 1/20 0.56
MAPK14 Q16539 9/20 0.54
CSNK1D P48730 2/20 0.54
CSNK1E P49674 2/20 0.54
PTPN1 P18031 1/20 0.51
SMPD3 Q9NY59 1/20 0.51
NOX1 Q9Y5S8 1/20 0.51
MAPK13 O15264 6/20 0.50
MAPK12 P53778 6/20 0.50
MAPK11 Q15759 6/20 0.50
GCGR P47871 3/20 0.50
RAF1 P04049 3/20 0.50
TP53 P04637 1/20 0.50
MAPT P10636 1/20 0.50
BRAF P15056 1/20 0.50
MAPK9 P45984 1/20 0.50
F2 P00734 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2686550 0.85 KDM4E (0.61) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL8413539 0.83 NT5E (0.56) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL2951436 0.82 MAPK14 (0.69) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL16582529 0.81 MGAM (0.60) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL13379393 0.81 MGAM (0.72) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL31429640 0.79 MGAM (0.80) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL4293823 0.79 MGAM (0.79) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL17133348 0.78 MGAM (0.77) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL84128 0.77 MGAM (1.00) MGAMPOLBKDM4ENT5EMAPK14
SCHEMBL29431952 0.77 MGAM (1.00) MGAMPOLBKDM4ENT5EMAPK14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
CN-119894957-A Epoxy resin composition, resin paste, film-type adhesive, printed circuit board, semiconductor chip package, and electronic device 旭化成株式会社 2025-04-25 CN disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L MGAM 3810/4885POLB 3019/4885KDM4E 160/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.