⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7121001 | 0.82 | — | — | |
| SCHEMBL1355664 | 0.82 | — | — | |
| SCHEMBL18863918 | 0.82 | — | — | |
| SCHEMBL31229298 | 0.67 | — | — | |
| SCHEMBL11546687 | 0.67 | — | — | |
| SCHEMBL31619572 | 0.67 | — | — | |
| SCHEMBL910682 | 0.67 | — | — | |
| SCHEMBL31619573 | 0.67 | — | — | |
| Water SCHEMBL19457681 | 0.67 | — | — | |
| SCHEMBL7548139 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119932504-A | Copper contact coating process based on magnetron sputtering method | 西安福莱电工合金有限公司 | 2025-05-06 | — | — | CN | claimed |
| CN-119932504-B | Copper contact coating process based on magnetron sputtering method | 西安福莱电工合金有限公司 | 2025-07-15 | — | — | CN | disclosed |
| CN-119932504-A | Copper contact coating process based on magnetron sputtering method | 西安福莱电工合金有限公司 | 2025-05-06 | — | — | CN | disclosed |
| CN-119932504-A | Copper contact coating process based on magnetron sputtering method | 西安福莱电工合金有限公司 | 2025-05-06 | — | — | CN | disclosed |