⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31452889 | 1.00 | — | — | |
| Ammonia Solution, Strong SCHEMBL9565343 | 0.96 | — | — | |
| Thiosulfuric Acid SCHEMBL8053554 | 0.67 | CA1 (0.46) | — | |
| Thiosulfuric Acid SCHEMBL8338661 | 0.67 | — | — | |
| Thiosulfuric Acid SCHEMBL27304767 | 0.65 | CA1 (0.43) | — | |
| Thiosulfuric Acid SCHEMBL10578322 | 0.65 | — | — | |
| Thiosulfuric Acid SCHEMBL28800486 | 0.65 | — | — | |
| Thiosulfuric Acid SCHEMBL9345935 | 0.65 | CA1 (0.43) | — | |
| SCHEMBL7038706 | 0.64 | — | — | |
| Methane SCHEMBL8582138 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119736676-A | Sulfhydryl sulfonic acid cyanide-free gold plating electroplating solution and preparation method and application thereof | 大连理工大学 | 2025-04-01 | — | — | CN | claimed |
| CN-119736676-B | Sulfhydryl sulfonic acid cyanide-free gold plating electroplating solution and preparation method and application thereof | 大连理工大学 | 2025-12-12 | — | — | CN | disclosed |
| CN-119736676-A | Sulfhydryl sulfonic acid cyanide-free gold plating electroplating solution and preparation method and application thereof | 大连理工大学 | 2025-04-01 | — | — | CN | disclosed |
| CN-119736676-A | Sulfhydryl sulfonic acid cyanide-free gold plating electroplating solution and preparation method and application thereof | 大连理工大学 | 2025-04-01 | — | — | CN | disclosed |