SCHEMBL31473065

SCHEMBL31473065

Nc1ccc(NC(=O)CCCCCCC(=O)Nc2ccc(N)cc2)cc1

nearest known ligand 0.64

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 11/20 0.63
HDAC6 Q9UBN7 10/20 0.63
HDAC3 O15379 10/20 0.63
HDAC2 Q92769 10/20 0.63
HDAC11 Q96DB2 8/20 0.63
HDAC8 Q9BY41 8/20 0.63
HDAC4 P56524 8/20 0.63
HDAC10 Q969S8 8/20 0.63
HDAC7 Q8WUI4 7/20 0.63
HDAC9 Q9UKV0 7/20 0.63
HDAC5 Q9UQL6 7/20 0.63
MEN1 O00255 1/20 0.61
KMT2A Q03164 1/20 0.61
NCOR2 Q9Y618 3/20 0.59
KDM4E B2RXH2 1/20 0.58
BRD4 O60885 1/20 0.58
NCOR1 O75376 1/20 0.58
NR1I2 O75469 1/20 0.58
EGFR P00533 1/20 0.58
CYP3A4 P08684 1/20 0.58

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18660183 1.00 HDAC1 (0.63) HDAC1HDAC6HDAC3HDAC2HDAC11
SCHEMBL18660182 0.98 MEN1 (0.62) HDAC1HDAC6HDAC3HDAC2HDAC11
SCHEMBL23054846 0.93 HDAC1 (0.71) HDAC1HDAC6HDAC3HDAC2HDAC11
SCHEMBL8244867 0.93 HDAC1 (0.74) HDAC1HDAC6HDAC3HDAC2HDAC11
SCHEMBL1064492 0.93 HDAC1 (0.74) HDAC1HDAC6HDAC3HDAC2HDAC11
SCHEMBL7774872 0.91 CA1 (0.66) HDAC1HDAC3HDAC2MEN1KMT2A
SCHEMBL3918802 0.91 CA1 (0.66) HDAC1HDAC3HDAC2MEN1KMT2A
SCHEMBL3919184 0.91 CA1 (0.66) HDAC1HDAC3HDAC2MEN1KMT2A
SCHEMBL3913717 0.91 CA1 (0.66) HDAC1HDAC3HDAC2MEN1KMT2A
SCHEMBL7770155 0.91 CA1 (0.66) HDAC1HDAC3HDAC2MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119735806-A Fluorine-free alkali-soluble resin, composition containing the same, cured film, and pattern processing method 武汉柔显科技股份有限公司 2025-04-01 CN disclosed