⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3142501 | 0.86 | — | — | |
| SCHEMBL26115576 | 0.83 | — | — | |
| SCHEMBL28532669 | 0.82 | — | — | |
| SCHEMBL26116418 | 0.81 | — | — | |
| SCHEMBL2173101 | 0.78 | — | — | |
| SCHEMBL11233584 | 0.78 | TSHR (0.31) | — | |
| SCHEMBL730419 | 0.77 | — | — | |
| SCHEMBL15414787 | 0.77 | — | — | |
| SCHEMBL11428067 | 0.74 | — | — | |
| SCHEMBL728407 | 0.73 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| US-20250215200-A1 | SEALING APPARATUS | NOK CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| CN-120021354-A | Method for manufacturing circuit board | 味之素株式会社 | 2025-05-20 | — | — | CN | disclosed |
| EP-4502033-A1 | SEALING DEVICE | NOK Corporation (JP) | 2025-02-05 | — | — | EP | disclosed |
| US-20170102613-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-04-13 | — | — | US | disclosed |
| US-9575410-B2 | Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2017-02-21 | — | — | US | disclosed |
| US-20140349222-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2014-11-27 | — | — | US | disclosed |
| US-7687208-B2 | Positive photosensitive resin composition | ASAHI KASEI EMD CORPORATION (JP) | 2010-03-30 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-6916540-B2 | Second layer formed under the first layercomprising a needle-like antimony-containing tin oxide to reduce static | JSR CORPORATION (JP) | 2005-07-12 | — | — | US | disclosed |
| EP-1245968-B1 | Laminate comprising a needle-like antimony-containing tin oxide and antireflection film comprising the same | JSR CORP (JP) | 2004-06-30 | — | — | EP | disclosed |
| US-20020197485-A1 | Laminate and antireflection film comprising the same | JSR CORPORATION (JP) | 2002-12-26 | — | — | US | disclosed |
| EP-1245968-A2 | Laminate comprising a needle-like antimony-containing tin oxide and antireflection film comprising the same | JSR Corporation (JP) | 2002-10-02 | — | — | EP | disclosed |