SCHEMBL3165625

SCHEMBL3165625

CCc1cn(N)nn1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18751762 0.78 — —
SCHEMBL9662141 0.76 — —
SCHEMBL10718176 0.76 CYP19A1 (0.53) —
SCHEMBL826111 0.73 — —
SCHEMBL8122466 0.73 — —
SCHEMBL16688337 0.73 — —
SCHEMBL14802384 0.73 — —
SCHEMBL9530296 0.71 — —
SCHEMBL18270512 0.71 — —
SCHEMBL10065935 0.71 CYP19A1 (0.42) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9526169-B2 Printed circuit board and method for manufacturing the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2016-12-20 — — US disclosed
CN-102548248-B Printed circuit board and manufacturing method thereof SAMSUNG ELECTRO-MECHANICS CO.,LTD. (KR) 2016-01-20 — — CN disclosed
US-20150382461-A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-12-31 — — US disclosed
US-9161460-B2 Printed circuit board and method for manufacturing the same SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2015-10-13 — — US disclosed
US-20120168212-A1 PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME KOREA E&S CO., LTD. (KR) 2012-07-05 — — US disclosed
CN-102548248-A Printed circuit board and manufacturing method thereof KOREA E & S CO LTD 2012-07-04 — — CN disclosed
CN-101668883-B Copper surface treating agent and surface treatment method MEC CO LTD 2011-11-23 — — CN disclosed
CN-101280426-B Method for manufacturing substrate and copper surface treatment agent therefor MEC CORP 2011-03-16 — — CN disclosed
EP-2161354-A1 COPPER SURFACE TREATING AGENT AND SURFACE TREATMENT METHOD MEC COMPANY LTD. (JP) 2010-03-10 — — EP disclosed
CN-101668883-A Copper surface treating agent and surface treatment method MEC CO LTD 2010-03-10 — — CN disclosed
EP-0135332-A1 Herbicidal benzenesulfonamides, benzylsulfonamides and benzenesulfamates E.I. DU PONT DE NEMOURS AND COMPANY (US) 1985-03-27 — — EP disclosed
US-4502882-A HERBICIDES, PLANT GROWTH REGULATORS E. I. DU PONT DE NEMOURS AND COMPANY (US) 1985-03-05 — — US disclosed
US-4465506-A Herbicidal N-[heterocyclicaminocarbonyl]-1H-indene and tetrahydronaphthalene sulfonamides E. I. DUPONT DE NEMOURS AND COMPANY (US) 1984-08-14 — — US disclosed
EP-0107979-A1 Novel phenyl-substituted sulfonamides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1984-05-09 — — EP disclosed
EP-0106512-A2 Herbicidal ortho-alkyl- and ortho-alkenyl-substituted benzenesulfonamides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1984-04-25 — — EP disclosed
US-4421550-A PRE- AND POSTEMERGENCE E. I. DU PONT DE NEMOURS & CO. (US) 1983-12-20 — — US disclosed
EP-0083975-A2 Herbicidal sulfonamides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1983-07-20 — — EP disclosed
EP-0082681-A2 Herbicidal sulfonamides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1983-06-29 — — EP disclosed
EP-0079683-A2 Herbicidal sulfonamides E.I. DU PONT DE NEMOURS AND COMPANY (US) 1983-05-25 — — EP disclosed
EP-0073562-A2 Herbicidal triazole ureas E.I. DU PONT DE NEMOURS AND COMPANY (US) 1983-03-09 — — EP disclosed
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