⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Zinc Ion SCHEMBL3419863 | 0.94 | — | — | |
| Zinc Ion SCHEMBL4131232 | 0.94 | — | — | |
| Zinc Ion SCHEMBL33396 | 0.94 | — | — | |
| Zinc Ion SCHEMBL5172655 | 0.94 | — | — | |
| Zinc Ion SCHEMBL6306322 | 0.88 | — | — | |
| Zinc Ion SCHEMBL42546 | 0.88 | — | — | |
| Zinc Ion SCHEMBL2122359 | 0.88 | — | — | |
| Water SCHEMBL7264001 | 0.88 | — | — | |
| SCHEMBL16796526 | 0.88 | — | — | |
| Zinc Ion SCHEMBL1774073 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8730648-B2 | Electrical component | EPCOS AG (DE) | 2014-05-20 | — | — | US | claimed |
| US-20100014213-A1 | Electrical component | TDK ELECTRONICS AG (DE) | 2010-01-21 | — | — | US | claimed |
| EP-1185143-A9 | HOT PLATE AND CONDUCTOR PASTE | IBIDEN CO., LTD. (JP) | 2002-05-15 | — | — | EP | claimed |
| EP-1185143-A1 | HOT PLATE AND CONDUCTOR PASTE | IBIDEN CO., LTD. (JP) | 2002-03-06 | — | — | EP | claimed |
| EP-1185144-A1 | HOT PLATE AND CONDUCTIVE PASTE | IBIDEN CO., LTD. (JP) | 2002-03-06 | — | — | EP | claimed |
| CN-116535097-B | Glass powder, conductive copper paste and multilayer ceramic capacitor for MLCC and preparation method | 武汉理工大学 | 2024-10-11 | — | — | CN | disclosed |
| CN-116535097-A | Glass powder, conductive copper paste and multilayer ceramic capacitor for MLCC and preparation method | 武汉理工大学 | 2023-08-04 | — | — | CN | disclosed |
| CN-102153341-B | Medium dielectric constant low-temperature co-fired ceramic material and preparation method thereof | SHENZHEN SUNLORD ELECTRONICS | 2013-06-05 | — | — | CN | disclosed |
| CN-103021567-A | Preparation method of front electrode silver paste for silicon-based solar energy | IRICO GROUP CORP | 2013-04-03 | — | — | CN | disclosed |
| CN-102153341-A | Medium dielectric constant low-temperature co-fired ceramic material and preparation method thereof | SHENZHEN SUNLORD ELECTRONICS | 2011-08-17 | — | — | CN | disclosed |
| JP-2004262683-A | MAGNETIC OXIDE SINTERED COMPACT AND HIGH-FREQUENCY CIRCUIT PART USING THE SAME | TDK CORP | 2004-09-24 | — | — | JP | disclosed |
| JP-2004262682-A | MAGNETIC OXIDE SINTERED COMPACT AND HIGH-FREQUENCY CIRCUIT PART USING THE SAME | TDK CORP | 2004-09-24 | — | — | JP | disclosed |
| JP-2002260914-A | SINTERED MAGNETIC OXIDE AND HIGH-FREQUENCY CIRCUIT PART USING THE SAME | TDK CORP | 2002-09-13 | — | — | JP | disclosed |
| JP-2002260912-A | SINTERED MAGNETIC OXIDE AND HIGH-FREQUENCY CIRCUIT PART USING THE SAME | TDK CORP | 2002-09-13 | — | — | JP | disclosed |
| EP-1185143-A9 | HOT PLATE AND CONDUCTOR PASTE | IBIDEN CO., LTD. (JP) | 2002-05-15 | — | — | EP | disclosed |
| EP-1185143-A1 | HOT PLATE AND CONDUCTOR PASTE | IBIDEN CO., LTD. (JP) | 2002-03-06 | — | — | EP | disclosed |
| EP-1185144-A1 | HOT PLATE AND CONDUCTIVE PASTE | IBIDEN CO., LTD. (JP) | 2002-03-06 | — | — | EP | disclosed |