⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12887874 | 1.00 | — | — | |
| SCHEMBL3991319 | 0.94 | — | — | |
| SCHEMBL949025 | 0.94 | — | — | |
| SCHEMBL3991317 | 0.89 | — | — | |
| SCHEMBL952288 | 0.89 | — | — | |
| SCHEMBL17747947 | 0.89 | — | — | |
| SCHEMBL14157108 | 0.88 | — | — | |
| SCHEMBL7174935 | 0.88 | — | — | |
| SCHEMBL14157195 | 0.88 | — | — | |
| SCHEMBL247367 | 0.88 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8426852-B2 | Transistors and electronic apparatuses including same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-04-23 | — | — | US | claimed |
| US-20110133176-A1 | Transistor and electronic apparatus including same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-09 | — | — | US | claimed |
| US-7842734-B2 | Poly(arylene ether) copolymers containing pyridine units as proton exchange membranes | ADVENT TECHNOLOGIES SA (GR) | 2010-11-30 | — | — | US | claimed |
| US-7800102-B2 | Organic thin film transistor including a self-assembly monolayer between an insulating layer and an organic semiconductor layer and flat panel display comprising the same | SAMSUNG MOBILE DISPLAY CO., LTD. (KR) | 2010-09-21 | — | — | US | claimed |
| WO-2008117113-A2 | POLY (ARYLENE ETHER) COPOLYMER CONTAINING PYRIDINE UNITS AND ITS USE AS PROTON EXCHANGE MEMBRANES | ADVENT TECHNOLOGIES (GR) | 2008-10-02 | — | — | WO | claimed |
| US-20080160378-A1 | Novel poly(arylene ether) copolymers containing pyridine units as proton exchange membranes | ADVENT TECHNOLOGIES SA (GR) | 2008-07-03 | — | — | US | claimed |
| EP-1777757-A2 | Organic thin film transistor comprising a self assembled monolayer | Samsung SDI Co., Ltd. (KR) | 2007-04-25 | — | — | EP | claimed |
| US-20070087489-A1 | Organic thin film transistor, method of manufacturing the same, and flat panel display comprising the same | SAMSUNG SDI CO., LTD. (KR) | 2007-04-19 | — | — | US | claimed |
| EP-1390972-B1 | METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | IBM (US) | 2006-07-12 | — | — | EP | claimed |
| US-6726996-B2 | USEFUL AS A DIELECTRIC CAPPING LAYER FOR INTERCONNECT STRUCTURES THAT INCLUDE WIRING REGIONS THAT ARE SURROUNDED BY ORGANIC INTERLEVEL DIELECTRICS, OR POROUS DIELECTRICS (INCLUDING ORGANIC AND INORGANIC) | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-04-27 | — | — | US | claimed |
| EP-1390972-A2 | METHOD OF FABICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | International Business Machines Corporation (US) | 2004-02-25 | — | — | EP | claimed |
| US-20020172811-A1 | Useful as a dielectric capping layer for interconnect structures that include wiring regions that are surrounded by organic interlevel dielectrics, or porous dielectrics (including organic and inorganic) | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-11-21 | — | — | US | claimed |
| US-20020160600-A1 | Method of fabricating low-dielectric constant interlevel dielectric films for BEOL interconnects with enhanced adhesion and low-defect density | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-10-31 | — | — | US | claimed |
| US-6455443-B1 | APPLYING UNIFORM COATING OF SILANE COUPLING AGENT CONTAINING POLYMERIZABLE GROUP TO SURFACE OF SUBSTRATE, HEATING TO PROVIDE MODIFIED SURFACE LAYER CONTAINING SI-O BONDS, RINSING WITH SOLVENT TO REMOVE UNREACTED COUPLER, APPLYING DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-09-24 | — | — | US | claimed |
| WO-2002069381-A2 | METHOD OF FABRICATING LOW-DIELECTRIC CONSTANT INTERLEVEL DIELECTRIC FILMS FOR BEOL INTERCONNECTS WITH ENHANCED ADHESION AND LOW-DEFECT DENSITY | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2002-09-06 | — | — | WO | claimed |
| US-6120970-A | Polybenzoxazole and polybenzothiazole precursors | SIEMENS AKTIENGESELLSCHAFT (DE) | 2000-09-19 | — | — | US | claimed |
| JP-1236205-A | — | — | None | — | — | JP | disclosed |
| JP-1168630-A | — | — | None | — | — | JP | disclosed |
| JP-H01236205-A | THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF | HITACHI LTD | 1989-09-21 | — | — | JP | disclosed |
| JP-H01168630-A | NOVEL FLUORINE-CONTAINING AROMATIC UNSATURATED COMPOUND AND PRODUCTION THEREOF | CENTRAL GLASS CO LTD | 1989-07-04 | — | — | JP | disclosed |