SCHEMBL3218285

SCHEMBL3218285

[MgH2].[W]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7079448 0.82
Water SCHEMBL28100139 0.82
SCHEMBL27511290 0.82
SCHEMBL7164265 0.82
SCHEMBL28586763 0.82
SCHEMBL28249583 0.82
SCHEMBL28145162 0.82
SCHEMBL27752996 0.82
Methane SCHEMBL27331143 0.82
SCHEMBL18917327 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12328927-B2 Low resistance and reduced reactivity approaches for fabricating contacts and the resulting structures INTEL COPORATION (US) 2025-06-10 US claimed
CN-113277513-B Calcium carbide co-production system 上海柯来浦能源科技有限公司 2024-04-19 CN claimed
CN-115083891-A Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2022-09-20 CN claimed
US-20220102522-A1 LOW RESISTANCE AND REDUCED REACTIVITY APPROACHES FOR FABRICATING CONTACTS AND THE RESULTING STRUCTURES INTEL CORPORATION 2022-03-31 US claimed
EP-3975262-A1 LOW RESISTANCE AND REDUCED REACTIVITY APPROACHES FOR FABRICATING CONTACTS AND THE RESULTING STRUCTURES INTEL Corporation (US) 2022-03-30 EP claimed
CN-113539958-A Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2021-10-22 CN claimed
CN-111048417-A Semiconductor structure and forming method thereof 中芯国际集成电路制造(上海)有限公司 2020-04-21 CN claimed
CN-109898037-A A kind of desulfuring and denitrifying apparatus absorption tower distribution plate material 江苏赛尔亚环保科技有限公司 2019-06-18 CN claimed
CN-107099717-B The technology of preparing of crystal boundary auto purification tungsten magnesium alloy 北京科技大学 2018-11-09 CN claimed
CN-107099717-A The technology of preparing of crystal boundary auto purification tungsten magnesium alloy 北京科技大学 2017-08-29 CN claimed
CN-104534184-B The metal composite pipe that coefficient of thermal expansion is low 常熟市东涛金属复合材料有限公司 2016-08-24 CN claimed
CN-104534184-A Metal composite tube with low thermal expansion rate CHANGSHU DONGTAO METAL COMPOSITE MATERIAL CO LTD 2015-04-22 CN claimed
US-20260138916-A1 GLASS-CERAMICS AND GLASSES CORNING INCORPORATED (US) 2026-05-21 US disclosed
US-12552704-B2 Glass-ceramics and glasses CORNING INCORPORATED (US) 2026-02-17 US disclosed
CN-120841955-A Lead-magnesium-tungsten-acid-base antiferroelectric material and preparation method of multilayer ceramic device thereof 北京科技大学 2025-10-28 CN disclosed
US-20250194350-A1 DISPLAY DEVICE JAPAN DISPLAY INC. (JP) 2025-06-12 US disclosed
US-5783259-A HEAT EXCHANGING BODY SUPPORT METALLAMICS, INC. (US) 1998-07-21 US disclosed
US-5746966-A HEAT EXCHANGING BODY SUPPORT MEMBER, AND MOLDING CAVITY FORMED BY THERMAL SPRAYING OF METALLIC PARTICLES METALLAMICS, INC. (US) 1998-05-05 US disclosed
US-5609922-A Method of manufacturing molds, dies or forming tools having a cavity formed by thermal spraying REISING, ETHINGTON, LEARMAN & MCCULLOH, PLLC 1997-03-11 US disclosed
WO-1990001581-A1 A METHOD FOR THE MANUFACTURE OF LIGHT-STABLE PAPER FROM MECHANICAL PULP, AND PAPER PRODUCED IN ACCORDANCE WITH THE METHOD LUMALAMPAN AKTIEBOLAG (SE) 1990-02-22 WO disclosed