⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3482225 | 0.79 | — | — | |
| SCHEMBL3481850 | 0.75 | — | — | |
| SCHEMBL3482575 | 0.69 | — | — | |
| SCHEMBL838621 | 0.67 | — | — | |
| SCHEMBL3482912 | 0.65 | TSHR (0.35) | — | |
| SCHEMBL837767 | 0.64 | — | — | |
| SCHEMBL14275051 | 0.64 | — | — | |
| SCHEMBL566706 | 0.64 | — | — | |
| SCHEMBL22341415 | 0.64 | — | — | |
| SCHEMBL3626203 | 0.64 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118813056-B | High-foaming-rate liquid silicone rubber foam material and preparation method and application thereof | 浙江申禾丽阳科技有限公司 | 2025-01-24 | — | — | CN | claimed |
| CN-118813056-B | High-foaming-rate liquid silicone rubber foam material and preparation method and application thereof | 浙江申禾丽阳科技有限公司 | 2025-01-24 | — | — | CN | disclosed |
| CN-118813056-A | High-foaming-rate liquid silicone rubber foam material and preparation method and application thereof | 浙江申禾丽阳科技有限公司 | 2024-10-22 | — | — | CN | disclosed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-7745530-B2 | Aqueous emulsion resin compositions | DAIKIN INDUSTRIES, LTD. (JP) | 2010-06-29 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20050257558-A1 | Heat exchanger for air and freezer device | DAIKIN INDUSTRIES, LTD. (JP) | 2005-11-24 | — | — | US | disclosed |
| EP-1580514-A1 | HEAT EXCHANGER FOR AIR AND FREEZER DEVICE | Daikin Industries, Ltd. (JP) | 2005-09-28 | — | — | EP | disclosed |
| EP-0464704-B1 | Fluorine-containing copolymer and the curable composition containing the same | DAIKIN IND LTD (JP) | 1995-01-11 | — | — | EP | disclosed |
| US-5284919-A | Low temperature curing, waterproofing, acid resistance | KANSAI PAINT COMPANY, LIMITED (JP) | 1994-02-08 | — | — | US | disclosed |
| US-5260376-A | Fluoropolymers, hydroxy-polymer, polysiloxanes | KANSAI PAINT COMPANY, LIMITED (JP) | 1993-11-09 | — | — | US | disclosed |
| US-5242972-A | Acidic fluoropolymer is reacted with epoxysilane, weather resistant films | KANSAI PAINT CO., LTD. (JP) | 1993-09-07 | — | — | US | disclosed |
| US-5216081-A | Comprising a fluoroolefin, a beta-methyl alpha olefin, functionalized unsaturated compounds and unsaturated esters; paints; weatherproofing; solvent solubility; antisoilants | DAIKIN INDUSTRIES, LTD. (JP) | 1993-06-01 | — | — | US | disclosed |
| US-5169915-A | Solvent solubility, compatibility with curing agents | DAIKIN INDUSTRIES, LTD. (JP) | 1992-12-08 | — | — | US | disclosed |
| US-5166265-A | Protective coatings | KANSAI PAINT COMPANY, LIMITED (JP) | 1992-11-24 | — | — | US | disclosed |
| US-5130167-A | For automobiles, vinyl polymers containing silicon groups, epoxy groups and hydroxy groups | KANSAI PAINT COMPANY, LIMITED (JP) | 1992-07-14 | — | — | US | disclosed |
| EP-0464704-A1 | Fluorine-containing copolymer and the curable composition containing the same | DAIKIN INDUSTRIES, LIMITED (JP) | 1992-01-08 | — | — | EP | disclosed |
| US-5026793-A | Containing hydroxy, epoxy, and silane compounds with chelate compound containing aluminum, titanium, or zironium | KANSAI PAINT COMPANY LIMITED (JP) | 1991-06-25 | — | — | US | disclosed |