⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5014349 | 0.89 | — | — | |
| SCHEMBL306047 | 0.87 | — | — | |
| SCHEMBL196797 | 0.87 | — | — | |
| SCHEMBL11153571 | 0.87 | — | — | |
| SCHEMBL306493 | 0.87 | — | — | |
| SCHEMBL209554 | 0.87 | — | — | |
| SCHEMBL8836580 | 0.82 | — | — | |
| SCHEMBL28331178 | 0.75 | — | — | |
| SCHEMBL4072519 | 0.75 | — | — | |
| SCHEMBL6852574 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111682005-B | Semiconductor device and method for manufacturing the same | 株式会社东芝 | 2023-10-27 | — | — | CN | disclosed |
| CN-111682005-A | Semiconductor device and method for manufacturing the same | 株式会社东芝 | 2020-09-18 | — | — | CN | disclosed |
| US-20100022083-A1 | CARBON NANOTUBE INTERCONNECT STRUCTURES | INTEL CORPORATION (US) | 2010-01-28 | — | — | US | disclosed |
| US-7625817-B2 | Method of fabricating a carbon nanotube interconnect structures | INTEL CORPORATION (US) | 2009-12-01 | — | — | US | disclosed |
| US-7442634-B2 | Method for constructing contact formations | INTEL CORPORATION (US) | 2008-10-28 | — | — | US | disclosed |
| US-20070158199-A1 | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps | INTEL CORPORATION | 2007-07-12 | — | — | US | disclosed |
| US-20070155158-A1 | Carbon nanotube interconnect structures | INTEL CORPORATION | 2007-07-05 | — | — | US | disclosed |
| US-20060134902-A1 | Method for constructing contact formations | INTEL CORPORATION | 2006-06-22 | — | — | US | disclosed |
| EP-1053223-A1 | SERINE CARBONATES | Givaudan SA (CH) | 2000-11-22 | — | — | EP | disclosed |
| WO-2000034232-A1 | SERINE CARBONATES | GIVAUDAN SA (CH) | 2000-06-15 | — | — | WO | disclosed |
| EP-0984082-A1 | Process for coating of workpieces | Metallveredlung GmbH & Co. KG (DE) | 2000-03-08 | — | — | EP | disclosed |