Silver

Silver

SCHEMBL3265481

CCC(C(=O)[O-])C(=O)C(F)(F)F.[Ag+]

nearest known ligand 0.33

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

folP

The experimentally established mechanism targets of Silver. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.33
TSHR P16473 2/20 0.33
NFKB1 P19838 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
CA2 P00918 1/20 0.32
EPHX1 P07099 1/20 0.31
FAAH O00519 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28374858 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL29498963 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL28375195 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL3690049 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL7210418 0.96 CYP3A4 (0.37) CYP3A4TSHRNFKB1NPSR1CA2
Zinc Ion SCHEMBL23165793 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL30498498 0.96 CYP3A4 (0.33) CYP3A4TSHRNFKB1NPSR1CA2
Water SCHEMBL23166498 0.94 CYP3A4 (0.32) CYP3A4TSHRNFKB1NPSR1CA2
SCHEMBL1359717 0.82
SCHEMBL1360578 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7682774-B2 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods LG CHEM, LTD. (KR) 2010-03-23 US claimed
WO-2007119966-A9 RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS LG CHEMICAL LTD (KR) 2008-10-02 WO claimed
WO-2007119966-A1 RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS LG CHEM, LTD. (KR) 2007-10-25 WO claimed
US-20070243363-A1 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods LG CHEM, LTD. (KR) 2007-10-18 US claimed
US-20230274853-A1 THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF CLAP CO., LTD (KR) 2023-08-31 US disclosed
WO-2022012937-A1 THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF BASF SE (DE) 2022-01-20 WO disclosed
EP-3941167-A1 THIN METAL ELECTRODE FILMS, AND MANUFACTURING METHOD THEREOF BASF SE (DE) 2022-01-19 EP disclosed
US-7682774-B2 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods LG CHEM, LTD. (KR) 2010-03-23 US disclosed
WO-2007119966-A9 RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS LG CHEMICAL LTD (KR) 2008-10-02 WO disclosed
WO-2007119966-A1 RESIN COMPOSITION COMPRISING CATALYST PRECURSOR FOR ELECTROLESS PLATING TO FORM ELECTROMAGNETIC WAVE SHIELDING LAYER, METHODS FOR FORMING METAL PATTERNS USING THE RESIN COMPOSITION AND METAL PATTERNS FORMED BY THE METHODS LG CHEM, LTD. (KR) 2007-10-25 WO disclosed
US-20070243363-A1 Resin composition comprising catalyst precursor for electroless plating to form electromagnetic wave shielding layer, methods for forming metal patterns using the resin composition and metal patterns formed by the methods LG CHEM, LTD. (KR) 2007-10-18 US disclosed