SCHEMBL3271485

SCHEMBL3271485

[Co]C1=CC=CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4860171 0.81
SCHEMBL4860165 0.81
SCHEMBL11215783 0.79
SCHEMBL734241 0.71
SCHEMBL28081313 0.71
SCHEMBL645537 0.69
SCHEMBL2770773 0.69
SCHEMBL11075574 0.69
SCHEMBL3295678 0.69
SCHEMBL4960915 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7691442-B2 Ruthenium or cobalt as an underlayer for tungsten film deposition APPLIED MATERIALS, INC. (US) 2010-04-06 US claimed
US-20090142474-A1 RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION APPLIED MATERIALS, INC. 2009-06-04 US claimed
CN-115917707-A Method for producing high density doped carbon films for hardmask and other patterning applications 应用材料公司 2023-04-04 CN disclosed
WO-2022005700-A1 METHODS FOR PRODUCING HIGH-DENSITY DOPED-CARBON FILMS FOR HARDMASK AND OTHER PATTERNING APPLICATIONS APPLIED MATERIALS, INC. (US) 2022-01-06 WO disclosed
US-20210407801-A1 METHODS FOR PRODUCING HIGH-DENSITY DOPED-CARBON FILMS FOR HARDMASK AND OTHER PATTERNING APPLICATIONS APPLIED MATERIALS, INC. 2021-12-30 US disclosed
US-7691442-B2 Ruthenium or cobalt as an underlayer for tungsten film deposition APPLIED MATERIALS, INC. (US) 2010-04-06 US disclosed
US-20090142474-A1 RUTHENIUM AS AN UNDERLAYER FOR TUNGSTEN FILM DEPOSITION APPLIED MATERIALS, INC. 2009-06-04 US disclosed