Ammonia Solution, Strong

Ammonia Solution, Strong

SCHEMBL3277366

Cl[SiH2]Cl.N

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9421787 0.89
SCHEMBL28529086 0.80
SCHEMBL13279759 0.80
SCHEMBL28838048 0.80
SCHEMBL1895030 0.80
SCHEMBL28932269 0.80
SCHEMBL10824466 0.80
SCHEMBL9234557 0.80
SCHEMBL5415465 0.80
SCHEMBL2734608 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 64 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1283000-C Technology for forming side-wall of flash memory control grid cumulate texture SHANGHAI HUA HONG GROUP CO LTD (CN) 2006-11-01 CN claimed
CN-1547253-A Technology for forming side-wall of flash memory control grid cumulate texture () 2004-11-17 CN claimed
EP-1018145-A2 MICROBELLOWS ACTUATOR CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 2000-07-12 EP claimed
WO-1998048608-A2 MICROBELLOWS ACTUATOR CALIFORNIA INSTITUTE OF TECHNOLOGY (US) 1998-11-05 WO claimed
JP-9260586-A None JP disclosed
US-10249674-B2 Semiconductor device and electronic apparatus including a semiconductor device having bonded sensor and logic substrates SONY CORPORATION (JP) 2019-04-02 US disclosed
CN-108565221-A Ultra-low interface state interface structure matched with (Al, In) GaN material and preparation method thereof 中国科学院微电子研究所 2018-09-21 CN disclosed
US-20170338268-A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE SONY CORP (JP) 2017-11-23 US disclosed
CN-107342216-A Plasma-activated conforma dielectric film deposition 诺发系统公司 2017-11-10 CN disclosed
CN-103890910-B Method and apparatus for plasma activated conformal dielectric film deposition 诺发系统公司 2017-05-17 CN disclosed
CN-103975419-B Plasma activated conformal dielectric film deposition 诺发系统公司 2017-04-12 CN disclosed
CN-103243310-B Method for plasma activated conformal film deposition on substrate surface 诺发系统公司 2017-04-12 CN disclosed
US-5874368-A UNIFORM LOW TEMPERATURE LOW PRESSURE CHEMICAL VAPOR DEPOSITION AIR PRODUCTS AND CHEMICALS, INC. (US) 1999-02-23 US disclosed
EP-0886309-A1 Dry oxidation for LOCOS isolation process using an anti-oxidation mask having a layered pad oxide and a silicon nitride stack and semiconductor device employing the same LUCENT TECHNOLOGIES INC. (US) 1998-12-23 EP disclosed
JP-H09260586-A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF NIPPON STEEL CORP 1997-10-03 JP disclosed
US-4992299-A Deposition of silicon nitride films from azidosilane sources AIR PRODUCTS AND CHEMICALS, INC. (US) 1991-02-12 US disclosed
EP-0096062-B1 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR NCR CORPORATION (US) 1986-06-04 EP disclosed
US-4438157-A METAL-NITRIDE-OXIDE-SEMICONDUCTOR NCR CORPORATION (US) 1984-03-20 US disclosed
EP-0096062-A1 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR. NCR CO (US) 1983-12-21 EP disclosed
WO-1983002199-A1 NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREFOR NCR CO (US) 1983-06-23 WO disclosed