SCHEMBL3277698

SCHEMBL3277698

C[SiH](C)CN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16308910 0.71
SCHEMBL4123509 0.67
Ethylamine SCHEMBL20487154 0.67
SCHEMBL231464 0.59
SCHEMBL311432 0.59
SCHEMBL296998 0.59
SCHEMBL561102 0.56
Hydrochloric Acid SCHEMBL11804288 0.56
SCHEMBL832688 0.56
SCHEMBL1324976 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2197879-A1 C7-SUBSTITUTED CAMPTOTHECIN ANALOGS BIONUMERIK PHARMACEUTICALS, INC. (US) 2010-06-23 EP claimed
WO-2009051580-A1 C7-SUBSTITUTED CAMPTOTHECIN ANALOGS BIONUMERIK PHARMACEUTICALS, INC. (US) 2009-04-23 WO claimed
JP-8234451-A None JP disclosed
CN-108735756-B Substrate processing method and semiconductor device manufactured by the same ASM知识产权私人控股有限公司 2022-11-22 CN disclosed
CN-110660653-A Thin film deposition method ASM知识产权私人控股有限公司 2020-01-07 CN disclosed
CN-108122739-A The method of the plasma enhancing cyclic deposition of topology limitation ASM IP控股有限公司 2018-06-05 CN disclosed
US-20170355825-A1 SILICONE-MODIFIED POLYIMIDE RESIN COMPOSITION OF SOLVENT FREE TYPE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-14 US disclosed
US-9676910-B2 Composition for preparing polyimide, polymer, article including polymer, and display device including article SAMSUNG ELECTRONICS CO., LTD. (KR) 2017-06-13 US disclosed
US-9334370-B2 Poly(imide-amide) copolymer, article including poly(imide-amide) copolymer, and display device including the article SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-05-10 US disclosed
US-20160096927-A1 COMPOSITION FOR PREPARING POLYIMIDE-INORGANIC PARTICLE COMPOSITE, ARTICLE PREPARED THEREFROM, AND OPTICAL DEVICE COMPRISING SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-04-07 US disclosed
US-20150361232-A1 COMPOSITION FOR PREPARING POLYIMIDE-INORGANIC COMPOSITE MATERIAL, AND ARTICLE PREPARED BY USING SAME SAMSUNG ELECTRONICS., LTD. (KR) 2015-12-17 US disclosed
US-8673999-B2 Water based primer composition for isocyante and silane functional adhesives DOW GLOBAL TECHNOLOGIES LLC (US) 2014-03-18 US disclosed
CN-102239201-B Method for producing organosilicon compounds having amino groups WACKER CHEMIE AG 2013-11-06 CN disclosed
US-20120318436-A1 WATER BASED PRIMER COMPOSITION FOR ISOCYANTE AND SILANE FUNCTIONAL ADHESIVES DOW GLOBAL TECHNOLOGIES LLC (US) 2012-12-20 US disclosed
CN-102239201-A Method for producing organosilicon compounds having amino groups WACKER CHEMIE AG 2011-11-09 CN disclosed
US-7816009-B2 Organosilyl functionalized particles and the production thereof WACKER CHEMIE AG (DE) 2010-10-19 US disclosed
US-20060020097-A1 Organosilyl functionalized particles and the production thereof CONSORTIUM FUR ELEKTROCHEMISCHE INDUSTRIE GMBH (DE) 2006-01-26 US disclosed
JP-H08234451-A PATTERN FORMING METHOD HITACHI LTD 1996-09-13 JP disclosed
EP-0291787-B1 Novel substituted silyl alkylene amines MERRELL DOW PHARMA (US) 1994-03-16 EP disclosed
EP-0291787-A1 Novel substituted silyl alkylene amines MERRELL DOW PHARMACEUTICALS INC. (US) 1988-11-23 EP disclosed