SCHEMBL3281561

SCHEMBL3281561

CCC1(CC2CCCCC2)COC1

nearest known ligand 0.35

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.35
EPHX1 P07099 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3885844 0.76 EPHX1 (0.31) EPHX1
SCHEMBL13168978 0.76 CYP1A2 (0.31) CYP1A2
SCHEMBL1352530 0.74
SCHEMBL1955819 0.72 EPHX1 (0.31) EPHX1
SCHEMBL18946193 0.72
SCHEMBL29194798 0.71 EPHX1 (0.36) EPHX1
SCHEMBL440173 0.71 NPC1 (0.32) EPHX1
SCHEMBL7673222 0.70 EPHX1 (0.36) EPHX1
SCHEMBL9821146 0.67 CHRM5 (0.33) CYP1A2
SCHEMBL1516363 0.67 EPHX1 (0.33) EPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12016187-B2 Encapsulating composition LG CHEM, LTD. (KR) 2024-06-18 US claimed
US-20210234111-A1 Encapsulating Composition LG CHEM, LTD. (KR) 2021-07-29 US claimed
US-20250386649-A1 ENCAPSULATABLE MATERIAL FOR DISPLAY DEVICE, ENCAPSULATING MATERIAL, ORGANIC EL DISPLAY, AND LED DISPLAY MITSUI CHEMICALS, INC. (JP) 2025-12-18 US disclosed
CN-119522654-A Display device 三井化学株式会社 2025-02-25 CN disclosed
CN-119498039-A Sealing material for display device, sealing material, organic EL display, and LED display 三井化学株式会社 2025-02-21 CN disclosed
WO-2024171602-A1 ADHESIVE FOR OPTICAL MATERIAL, OPTICAL ELEMENT, AND OPTICAL DEVICE 三井化学株式会社 2024-08-22 WO disclosed
CN-118511673-A Sealing material for organic EL display element, organic EL display device, and method for manufacturing organic EL display device 三井化学株式会社 2024-08-16 CN disclosed
CN-118451124-A Polymerizable composition, sealing material, image display device, and method for manufacturing image display device 三井化学株式会社 2024-08-06 CN disclosed
US-12016187-B2 Encapsulating composition LG CHEM, LTD. (KR) 2024-06-18 US disclosed
WO-2024095904-A1 ADHESIVE FOR OPTICAL IMAGE FORMATION DEVICE, CURED RESIN ARTICLE, OPTICAL ELEMENT, AND OPTICAL IMAGE FORMATION DEVICE 三井化学株式会社 2024-05-10 WO disclosed
WO-2024024620-A1 SEALING MATERIAL FOR DISPLAY DEVICE, SEALING MATERIAL, ORGANIC EL DISPLAY, AND LED DISPLAY 三井化学株式会社 2024-02-01 WO disclosed
EP-1847384-B1 METHOD FOR JOINING MEMBERS, COMPOSITE FILM AND USE THEREOF MITSUI CHEMICALS INC (JP) 2013-07-03 EP disclosed
US-8216684-B2 Electronics; composite films MITSU CHEMICALS, INC. (JP) 2012-07-10 US disclosed
CN-101111368-B Method for joining members, composite film and use thereof MITSUI CHEMICALS INC 2011-09-21 CN disclosed
US-7709553-B2 Photo cation polymerizable resin composition and surface protective material for optical disk MITSUI CHEMICALS, INC. (JP) 2010-05-04 US disclosed
US-20080160339-A1 Method For Bonding Members, Composite Film And Uses Thereof MITSUI CHEMICALS, INC. (JP) 2008-07-03 US disclosed
CN-101111368-A Method for joining members, composite film and use thereof MITSUI CHEMICALS INC (JP) 2008-01-23 CN disclosed
EP-1847384-A1 METHOD FOR JOINING MEMBERS, COMPOSITE FILM AND USE THEREOF Mitsui Chemicals, Inc. (JP) 2007-10-24 EP disclosed
US-20070037896-A1 polymerizable resin composition comprises an epoxy compound, a photo cation polymerization initiator, and a photo radical polymerization initiator; excellent in curing properties and corrosion resistance with less resin coloration and less cure shrinkage; surface protective material for optical disks MITSUI CHEMICALS, INC. (JP) 2007-02-15 US disclosed
EP-1630189-A1 CATIONICALLY PHOTOPOLYMERIZABLE RESIN COMPOSITION AND OPTICAL DISK SURFACE PROTECTION MATERIAL Mitsui Chemicals, Inc. (JP) 2006-03-01 EP disclosed