SCHEMBL329219

SCHEMBL329219

CCCCC[Si](CCCCC)(OCC)OCC

nearest known ligand 0.37

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.37
THRB P10828 1/20 0.37
DNM1 Q05193 8/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
ALDH1A1 P00352 1/20 0.35
EPHX1 P07099 1/20 0.35
LMNA P02545 2/20 0.32
OPRM1 P35372 1/20 0.31
SLC22A1 O15245 2/20 0.30
SLC22A2 O15244 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2123727 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL15847402 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2120262 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2120945 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2123739 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2122966 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2122736 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2122621 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL2119690 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A
SCHEMBL329138 0.97 TSHR (0.42) TSHRTHRBDNM1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 332 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12161005-B2 Light emitting device, method for manufacturing the same, and electronic device including the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2024-12-03 US claimed
US-20220149307-A1 LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2022-05-12 US claimed
US-11059920-B2 Process for producing high cis-1,4-polydiene with lanthanide-based catalyst compositions BRIDGESTONE CORPORATION (JP) 2021-07-13 US claimed
US-20190169330-A1 Process For Producing High Cis-1,4-Polydiene With Lanthanide-Based Catalyst Compositions BRIDGESTONE CORPORATION (JP) 2019-06-06 US claimed
EP-3491030-A1 PROCESS FOR PRODUCING HIGH CIS-1,4-POLYDIENE WITH LANTHANIDE-BASED CATALYST COMPOSITIONS Bridgestone Corporation (JP) 2019-06-05 EP claimed
WO-2018022994-A1 PROCESS FOR PRODUCING HIGH CIS-1,4-POLYDIENE WITH LANTHANIDE-BASED CATALYST COMPOSITIONS BRIDGESTONE CORPORATION (JP) 2018-02-01 WO claimed
EP-2712671-B1 METHOD FOR MANUFACTURING HYBRID PACKAGING MATERIAL KOREA ELECTROTECH RES INST (KR) 2016-05-18 EP claimed
US-20150329727-A1 A COATING COMPOSITION, A PREPARATION METHOD THEREFORE, AND USE THEREOF AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2015-11-19 US claimed
EP-2938753-A1 A COATING COMPOSITION, A PREPARATION METHOD THEREFORE, AND USE THEREOF Akzo Nobel Coatings International B.V. (NL) 2015-11-04 EP claimed
WO-2014102166-A9 A COATING COMPOSITION, A PREPARATION METHOD THEREFORE, AND USE THEREOF AKZO NOBEL COATINGS INTERNATIONAL B.V. (NL) 2014-09-18 WO claimed
US-20140076200-A1 METHOD FOR MANUFACTURING HYBRID PACKAGING MATERIAL KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE (KR) 2014-03-20 US claimed
US-8524441-B2 Silicon-based antireflective coating compositions AZ ELECTRONIC MATERIALS USA CORP. (US) 2013-09-03 US claimed
US-20120077040-A1 HEAT DISSIPATION COATING AGENT AND HEAT-DISSIPATING PLATE INCLUDING SAME KOREA ELECTROTECHNOLOGY RESEARCH INSTITUTE (KR) 2012-03-29 US claimed
US-20100092895-A1 SILICON-BASED ANTIREFLECTIVE COATING COMPOSITIONS BRAGGONE OY (FI) 2010-04-15 US claimed
US-7445953-B2 Low temperature curable materials for optical applications HONEYWELL INTERNATIONAL INC. (US) 2008-11-04 US claimed
US-20070202267-A1 Sizing compositions for glass and polyolefin surfaces and methods of use MARTIN EMIL 2007-08-30 US claimed
US-7015061-B2 preparing composition comprising at least one silicon containing pre-polymer having at least one organic group, a catalyst, and optionally water, coating substrate with composition to form film, crosslinking composition by heating HONEYWELL INTERNATIONAL INC. (US) 2006-03-21 US claimed
WO-2006017450-A1 LOW TEMPERATURE CURABLE MATERIALS FOR OPTICAL APPLICATIONS HONEYWELL INTERNATIONAL INC. (US) 2006-02-16 WO claimed
US-20060035419-A1 Low temperature curable materials for optical applications JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT 2006-02-16 US claimed
US-20060027803-A1 LOW TEMPERATURE CURABLE MATERIALS FOR OPTICAL APPLICATIONS HONEYWELL INTERNATIONAL, INC. 2006-02-09 US claimed