SCHEMBL3310164

SCHEMBL3310164

CO[PH](=O)O.[AlH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29592 0.96
Methane SCHEMBL8679400 0.92
SCHEMBL29130615 0.92
SCHEMBL7126703 0.92
SCHEMBL11337548 0.92
SCHEMBL7120704 0.92
SCHEMBL2406802 0.92
Ammonia Solution, Strong SCHEMBL10785340 0.92
SCHEMBL9282800 0.92
Phosphonic Acid SCHEMBL28112608 0.92

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114605730-B Polyolefin composition and preparation method and application thereof 金发科技股份有限公司 2023-12-22 CN claimed
US-20240182685-A1 POLYAMIDE COMPOSITIONS ENVALIOR DEUTSCHLAND GMBH (DE) 2024-06-06 US disclosed
CN-114605730-B Polyolefin composition and preparation method and application thereof 金发科技股份有限公司 2023-12-22 CN disclosed
CN-109306176-B Flame-retardant polyamide resin composition and preparation method thereof 东华大学 2020-05-05 CN disclosed
US-20150126650-A1 ANTIMONY-FREE FLAME-RETARDED STYRENIC THERMOPLASTIC POLYMER COMPOSITION, ARTICLE CONTAINING SAME AND METHOD OF MAKING SAME ICL-IP AMERICA INC. 2015-05-07 US disclosed
US-20100109185-A1 METHOD AND APPARATUS FOR MANUFACTURING UNEVEN THICKNESS RESIN SHEET FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
EP-2132019-A1 METHOD AND APPARATUS FOR MANUFACTURING UNEVEN THICKNESS RESIN SHEET Fujifilm Corporation (JP) 2009-12-16 EP disclosed
WO-2008123559-A1 METHOD AND APPARATUS FOR MANUFACTURING UNEVEN THICKNESS RESIN SHEET FUJIFILM CORPORATION (JP) 2008-10-16 WO disclosed