SCHEMBL332152

SCHEMBL332152

SCSC(CSCC(CSCC(SCS)SCS)(CSCC(SCS)SCS)CSCC(SCS)SCS)SCS

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL331555 0.74
SCHEMBL1576990 0.74
SCHEMBL332478 0.68
SCHEMBL331649 0.67
SCHEMBL331876 0.65
SCHEMBL331483 0.62
SCHEMBL27002629 0.59
SCHEMBL331434 0.58
SCHEMBL331278 0.58
SCHEMBL23151978 0.56

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 142 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4748893-A1 PHOTOCURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, COATING AGENT, CURED PRODUCT, SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND CURING, BONDING, SEALING, AND COATING METHODS USING PHOTOCURABLE RESIN COMPOSITION Namics Corporation (JP) 2026-05-27 EP disclosed
EP-4748869-A1 EPOXY RESIN COMPOSITION, ADHESIVE AGENT, SEALING MATERIAL, CURED ARTICLE, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
EP-4748870-A1 EPOXY RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT Namics Corporation (JP) 2026-05-27 EP disclosed
US-20260139157-A1 THERMAL-AND-UV-CURABLE (METH)ACRYLATE COMPOSITION HENKEL AG & CO KGAA (DE) 2026-05-21 US disclosed
WO-2026100231-A1 CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2026-05-15 WO disclosed
EP-4372030-B1 CURABLE RESIN COMPOSITION NAMICS CORP (JP) 2026-03-25 EP disclosed
US-20260062512-A1 CURABLE COMPOSITION, CURED PRODUCT, AND METHOD FOR PRODUCING CURED PRODUCT KUREHA CORPORATION (JP) 2026-03-05 US disclosed
US-20260062548-A1 RUBBER-BONDED CELLULOSE FIBERS AND MANUFACTURING METHOD THEREFOR, RESIN COMPOSITION AND MANUFACTURING METHOD THEREFOR, AND CURABLE RESIN COMPOSITION KUREHA CORPORATION (JP) 2026-03-05 US disclosed
EP-4620947-A1 ISOCYANATE COMPOSITION, MODIFIED ISOCYANATE, POLYURETHANE RESIN AND OPTICAL MATERIAL Wanhua Chemical Group Co., Ltd. (CN) 2025-09-24 EP disclosed
US-20250276316-A1 MICROFLUIDIC DEVICE AND METHOD OF MANUFACTURING THE SAME TRUVIAN SCIENCES, INC. (US) 2025-09-04 US disclosed
EP-2014700-A1 POLYMERIZABLE COMPOSITION, RESIN USING THE SAME AND OPTICAL COMPONENT Mitsui Chemicals, Inc. (JP) 2009-01-14 EP disclosed
EP-1988110-A1 INTERNAL MOLD RELEASE AGENT FOR PRODUCTION OF POLYTHIOURETHANE OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 2008-11-05 EP disclosed
EP-1988109-A1 POLYMERIZABLE COMPOSITION FOR POLYTHIOURETHANE OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 2008-11-05 EP disclosed
US-7396900-B2 Thiourethane-based optical material MITSUI CHEMICALS, INC. (JP) 2008-07-08 US disclosed
US-20070203318-A1 Polyurethanes Polymerizable Composition And Method For Producing Optical Resin Of The Same MITSUI CHEMICALS, INC. (JP) 2007-08-30 US disclosed
US-7244808-B2 Thiourethane-based optical material MITSUI CHEMICALS, INC. (JP) 2007-07-17 US disclosed
US-20070149822-A1 Thiourethane-based optical material MITSUI CHEMICALS, INC. (JP) 2007-06-28 US disclosed
EP-1746118-A1 POLYURETHANE POLYMERIZABLE COMPOSITION AND METHOD FOR PRODUCING OPTICAL RESIN COMPOSED OF SAME Mitsui Chemicals, Inc. (JP) 2007-01-24 EP disclosed
US-20050131203-A1 Thiourethane-based optical material MITSUI CHEMICALS, INC. (JP) 2005-06-16 US disclosed
EP-1505094-A1 THIOURETHANE-BASED OPTICAL MATERIAL Mitsui Chemicals, Inc. (JP) 2005-02-09 EP disclosed