SCHEMBL332213

SCHEMBL332213

C1CC[SiH2]OC1.[HH]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1814604 1.00
SCHEMBL8404063 0.97
SCHEMBL5085652 0.97
SCHEMBL9705838 0.97
Fluoride SCHEMBL8452106 0.97
SCHEMBL9219476 0.97
SCHEMBL16174 0.97
Ammonia Solution, Strong SCHEMBL218243 0.93
SCHEMBL453456 0.93
SCHEMBL2915272 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1611 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250179339-A1 HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS 3M INNOVATIVE PROPERTIES COMPANY 2025-06-05 US claimed
WO-2023170501-A1 HIGH TEMPERATURE STABLE CURABLE BONDING COMPOSITIONS 3M INNOVATIVE PROPERTIES COMPANY (US) 2023-09-14 WO claimed
CN-112203971-A Hydrogen carrier compound 氢试实验室有限公司 2021-01-08 CN claimed
US-9000065-B2 Polymers for contact lenses Ocutec Ltd. (GB) 2015-04-07 US claimed
US-20120302661-A1 Polymers for Contact Lenses OCUTEC LIMITED (GB) 2012-11-29 US claimed
US-7936068-B2 Semiconductor device having an interconnect structure and a reinforcing insulating film RENESAS ELECTRONICS CORPORATION (JP) 2011-05-03 US claimed
US-20100032845-A1 SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT STRUCTURE AND A REINFORCING INSULATING FILM AND METHOD OF MANUFACTURING SUCH DEVICE NEC ELECTRONICS CORPORATION (JP) 2010-02-11 US claimed
US-7612453-B2 Semiconductor device having an interconnect structure and a reinforcing insulating film NEC ELECTRONICS CORPORATION (JP) 2009-11-03 US claimed
US-7229921-B2 Semiconductor device and manufacturing method for the same NEC ELECTRONICS CORPORATION (JP) 2007-06-12 US claimed
US-7230337-B2 Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same NEC ELECTRONICS CORPORATION (JP) 2007-06-12 US claimed
US-5025073-A Containing inclusion compound of platinum complex GENERAL ELECTRIC COMPANY (US) 1991-06-18 US claimed
EP-0423588-A2 One part heat curable organopolysiloxane compositions GENERAL ELECTRIC COMPANY (US) 1991-04-24 EP claimed
US-4943596-A HIGH TENSILE STRENGTH, CONTAINS POLYIMIDE-POLYSILOXANE BLOCK POLYMER GENERAL ELECTRIC COMPANY (US) 1990-07-24 US claimed
US-4908228-A Dioxolane, diol and diacrylate silicon compounds and method for their preparation and use DOW CORNING CORPORATION (US) 1990-03-13 US claimed
EP-0341469-A2 High strength silicone foam, and methods for making GENERAL ELECTRIC COMPANY (US) 1989-11-15 EP claimed
US-4810728-A POLYIMIDESILOXANE BLOCK COPOLYMER GENERAL ELECTRIC COMPANY (US) 1989-03-07 US claimed
US-4766163-A UNSATURATED POLYESTER REACTED WITH ORGANOSILICON COMPOUND BRIDGES CORPORATION PTY LTD (AU) 1988-08-23 US claimed
EP-0266895-A2 Dioxolane, diol and diacrylate silicon compounds and method for their preparation and use DOW CORNING CORPORATION (US) 1988-05-11 EP claimed
US-4705765-A PLATINUM COMPLEX GENERAL ELECTRIC COMPANY (US) 1987-11-10 US claimed
US-4681963-A REACTION PRODUCT BETWEEN SILICON HYDRIDE OR ZILOXANE HYDRIDE AND PT(O) OR PT(II) CATALYST GENERAL ELECTRIC COMPANY (US) 1987-07-21 US claimed