⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL996897 | 0.85 | — | — | |
| SCHEMBL13169071 | 0.84 | — | — | |
| SCHEMBL9404241 | 0.82 | — | — | |
| SCHEMBL12898567 | 0.82 | — | — | |
| SCHEMBL309171 | 0.82 | — | — | |
| SCHEMBL10014104 | 0.77 | — | — | |
| SCHEMBL20090042 | 0.77 | — | — | |
| SCHEMBL13089133 | 0.77 | — | — | |
| SCHEMBL331046 | 0.75 | — | — | |
| SCHEMBL309836 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 195 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122056125-A | RF pulsed assisted low-K film deposition with high mechanical strength | 应用材料公司 | 2026-05-15 | — | — | CN | claimed |
| EP-4632019-A1 | COATING COMPOSITION FOR ARTIFICIAL LEATHER, METHODS AND USES THEREOF | TMG - Tecidos Plastificados e Outros Revestimentos para a Indústria Automóvel, S.A. (PT) | 2025-10-15 | — | — | EP | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| WO-2025034650-A1 | RF PULSING ASSISTED LOW-K DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | WO | claimed |
| US-20250054749-A1 | RF PULSING ASSISTED LOW-K FILM DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | US | claimed |
| US-7500397-B2 | Activated chemical process for enhancing material properties of dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2009-03-10 | — | — | US | claimed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | claimed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | claimed |
| US-20070181873-A1 | Organic-inorganic hybrid polymer and organic insulator composition having the same and methods thereof | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-09 | — | — | US | claimed |
| CN-122056125-A | RF pulsed assisted low-K film deposition with high mechanical strength | 应用材料公司 | 2026-05-15 | — | — | CN | disclosed |
| EP-4632019-A1 | COATING COMPOSITION FOR ARTIFICIAL LEATHER, METHODS AND USES THEREOF | TMG - Tecidos Plastificados e Outros Revestimentos para a Indústria Automóvel, S.A. (PT) | 2025-10-15 | — | — | EP | disclosed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | disclosed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | disclosed |
| WO-2025034650-A1 | RF PULSING ASSISTED LOW-K DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | WO | disclosed |
| EP-1122770-A2 | Silica-based insulating film and its manufacture | JSR Corporation (JP) | 2001-08-08 | — | — | EP | disclosed |
| US-20010009936-A1 | Method of manufacturing material for forming insulating film | JSR CORPORATION (JP) | 2001-07-26 | — | — | US | disclosed |
| EP-1117102-A2 | Method of manufacturing material for forming insulating film | JSR Corporation (JP) | 2001-07-18 | — | — | EP | disclosed |
| EP-1058274-A1 | Composition for film formation and material for insulating film formation | JSR Corporation (JP) | 2000-12-06 | — | — | EP | disclosed |
| EP-1045290-A2 | Composition for resist underlayer film and method for producing the same | JSR Corporation (JP) | 2000-10-18 | — | — | EP | disclosed |