SCHEMBL3336746

SCHEMBL3336746

C=CCCCCCCC[SiH](OCC)OCC

nearest known ligand 0.48

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.48
ALDH1A1 P00352 2/20 0.41
LMNA P02545 2/20 0.37
LPAR3 Q9UBY5 2/20 0.33
MAPT P10636 2/20 0.33
ABCC4 O15439 1/20 0.33
LPAR2 Q9HBW0 1/20 0.33
TRPA1 O75762 1/20 0.31
USP2 O75604 1/20 0.30
CYP3A4 P08684 1/20 0.30
RECQL P46063 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6037421 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL6037318 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL4380232 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL8510977 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL6037315 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL387079 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL8512174 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL8511146 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL8515574 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT
SCHEMBL26922374 1.00 TSHR (0.48) TSHRALDH1A1LMNALPAR3MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025023143-A1 GLASS CLOTH TREATMENT LIQUID AND SURFACE TREATED GLASS CLOTH 信越化学工業株式会社 2025-01-30 WO disclosed
CN-110461982-B Adhesive composition and structure 昭和电工材料株式会社 2022-12-27 CN disclosed
CN-111995975-B Adhesive composition and structure 日立化成株式会社 2022-12-02 CN disclosed
CN-108350320-B Adhesive composition and structure 昭和电工材料株式会社 2021-11-26 CN disclosed
CN-111995975-A Adhesive composition and structure 日立化成株式会社 2020-11-27 CN disclosed
CN-108350341-B Adhesive composition and structure 日立化成株式会社 2020-09-04 CN disclosed
US-9303180-B2 Low-temperature cureable coating composition and article having cured coating thereof SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-04-05 US disclosed
US-8968458-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2015-03-03 US disclosed
US-20140336329-A1 LOW-TEMPERATURE CUREABLE COATING COMPOSITION AND ARTICLE HAVING CURED COATING THEREOF SHIN-ETSU CHEMICAL CO., LTD. (JP) 2014-11-13 US disclosed
EP-2801596-A1 Low-temperature curable coating composition and article having cured coating thereof Shin-Etsu Chemical Co., Ltd. (JP) 2014-11-12 EP disclosed
US-8808446-B2 Composition for resist underlayer film and process for producing same JSR CORPORATION (JP) 2014-08-19 US disclosed
US-20120136082-A1 BINDING AGENTS BASED ON HIGHLY BRANCHED POLYOLEFINS COMPRISING SILANE GROUPS WACKER CHEMIE AG (DE) 2012-05-31 US disclosed
US-20100151384-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2010-06-17 US disclosed
US-20090050020-A1 COMPOSITION FOR RESIST UNDERLAYER FILM AND PROCESS FOR PRODUCING SAME JSR CORPORATION (JP) 2009-02-26 US disclosed
EP-1855159-A1 COMPOSITION FOR UNDERLAYER FILM OF RESIST AND PROCESS FOR PRODUCING THE SAME JSR Corporation (JP) 2007-11-14 EP disclosed