Sulfurous Acid

Sulfurous Acid

SCHEMBL33390

O=S(O)O.[Au].[NaH]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sulfurous Acid SCHEMBL28650582 1.00
Sulfurous Acid SCHEMBL28572633 1.00
Sulfurous Acid SCHEMBL15474485 1.00
Sulfurous Acid SCHEMBL8684064 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL8349231 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL10946517 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL10425425 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL11523855 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL10693687 0.94 CA1 (0.86)
Sulfurous Acid SCHEMBL8355354 0.94 CA1 (0.86)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1066 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117484096-B Manufacturing method of thin-wall gold cavity with special-shaped slotted hole 中国工程物理研究院激光聚变研究中心 2026-05-19 CN claimed
CN-120041862-A Preparation method of Au-doped iridium-based supported catalyst 大连理工大学 2025-05-27 CN claimed
CN-119877050-A Electroplating solution and electroplating method for nickel-gold alloy plating layer of MEMS (micro electro mechanical System) technology 强一半导体(上海)有限公司 2025-04-25 CN claimed
CN-119824500-A Gold plating method for silver ornament electrolyte 黔东南民族职业技术学院 2025-04-15 CN claimed
CN-119701994-A Ferromanganese-based catalyst for preparing methyl methacrylate and preparation and application thereof 中国科学院大连化学物理研究所 2025-03-28 CN claimed
CN-118223015-B Gold precipitation solution for electroless gold plating and preparation method thereof 珠海斯美特电子材料有限公司 2025-03-14 CN claimed
CN-119565600-A Catalyst for oxidative esterification and preparation method and application thereof 中国科学院大连化学物理研究所 2025-03-07 CN claimed
CN-119529275-A Quaternary ammonium salt polymer and preparation method thereof 深圳市联合蓝海应用材料科技股份有限公司 2025-02-28 CN claimed
CN-119530899-A Sulfite electroforming gold liquid and preparation method thereof 北京金百镀科技有限公司 2025-02-28 CN claimed
CN-119528801-A Quaternary ammonium salt compound taking tripyridyl benzene as framework and preparation method thereof 深圳市联合蓝海应用材料科技股份有限公司 2025-02-28 CN claimed
EP-1048618-A1 Process for making gold salt for use in electroplating process LUCENT TECHNOLOGIES INC. (US) 2000-11-02 EP claimed
US-6126807-A DECHLORINATION FROM SODIUM GOLD CHLORIDE, SULFITING; SODIUM GOLD SULFITE SOLUTION CAN BE SOLIDIFIED BY A FREEZE-DRYING PROCESS; USE IN GOLD ELECTROPLATING BATHS LUCENT TECHNOLOGIES INC. (US) 2000-10-03 US claimed
US-5935306-A CYANIDE-FREE; SODIUM GOLD SULFITE, ALKALI METAL OR AMMONIUM THIOSULFATE, ASCORBIC ACID OR SALT TECHNIC INC. (US) 1999-08-10 US claimed
EP-0618308-B1 Electroless gold plating bath UYEMURA C & CO LTD (JP) 1998-06-17 EP claimed
US-4880511-A ELECTRODIALYSIS, REVERSE OSMOSIS ELECTROPLATING ENGINEERS OF JAPAN, LIMITED (JP) 1989-11-14 US claimed
US-4435253-A CARBOXYLIC ACID ADDED TO MAINTAIN HARDNESS OF DEPOSIT OMI INTERNATIONAL CORPORATION (US) 1984-03-06 US claimed
US-4366035-A Electrodeposition of gold alloys ENGELHARD CORPORATION (US) 1982-12-28 US claimed
US-4048023-A Electrodeposition of gold-palladium alloys OXY METAL INDUSTRIES CORPORATION (US) 1977-09-13 US claimed
US-3981782-A ALKALI METAL GOLD SULFITE, ALKALI METAL NITRITE JOHNSON MATTHEY & CO., LIMITED (EN) 1976-09-21 US claimed
US-3966880-A Method for producing alkali metal gold sulfite AMERICAN CHEMICAL & REFINING COMPANY INC. (US) 1976-06-29 US claimed