SCHEMBL334206

SCHEMBL334206

ClC(Cl)(Cl)c1ccnnn1

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Iodide SCHEMBL30612391 0.98 CYP3A4 (0.32) CYP3A4TSHR
SCHEMBL1721868 0.77
SCHEMBL15863890 0.75 SMN1; SMN2 (0.30)
SCHEMBL27467454 0.75 NOTUM (0.34)
SCHEMBL1101943 0.75
Methane SCHEMBL22772351 0.73
SCHEMBL8727491 0.73
SCHEMBL3293566 0.72 TSHR (0.42) CYP3A4TSHR
SCHEMBL30730979 0.71
SCHEMBL14696065 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1236 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116194842-A Negative photoresist composition for I-line for improving step difference and LER between center and edge, and negative photoresist composition for I-line for improving process margin 荣昌化学制品株式会社 2023-05-30 CN claimed
US-11421049-B2 Photopolymerization synergist Piedmont Chemical Industries, LLC (US) 2022-08-23 US claimed
WO-2022065713-A1 I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR REDUCING HEIGHT DIFFERENCE BETWEEN CENTER AND EDGE AND REDUCING LER, AND I-LINE NEGATIVE PHOTORESIST COMPOSITION FOR IMPROVING PROCESS MARGIN 영창케미칼 주식회사 2022-03-31 WO claimed
CN-113741147-A Photoresist with high resolution and excellent adhesion 深圳惠美亚科技有限公司 2021-12-03 CN claimed
WO-2021096751-A1 PHOTOPOLYMERIZATION SYNERGIST Piedmont Chemical Industries, LLC (US) 2021-05-20 WO claimed
US-20210139616-A1 Photopolymerization Synergist Piedmont Chemical Industries, LLC 2021-05-13 US claimed
CN-106933036-B Preparation method of heat-sensitive positive photosensitive composition 安徽强邦印刷材料有限公司 2020-06-26 CN claimed
CN-106909025-B Photosensitive composition for heat-sensitive positive image CTP plate 安徽强邦印刷材料有限公司 2020-06-26 CN claimed
CN-106933037-B Preparation method of thermosensitive positive image CTP plate photosensitive composition 安徽强邦印刷材料有限公司 2020-06-26 CN claimed
US-10345701-B2 Photoresist polymers, photoresist compositions, methods of forming patterns and methods of manufacturing semiconductor devices SAMSUNG ELECTRONICS CO., LTD. (KR) 2019-07-09 US claimed
US-5876882-A FORMING PHOTOSENSITIVE FILM ON TRANSPARENT SUBSTRATE; MASKING; EXPOSURE TO LIGHT NIPPON OIL CO., LTD. (JP) 1999-03-02 US claimed
EP-0652483-B1 Lithographic printing plates MINNESOTA MINING & MFG (US) 1998-05-13 EP claimed
US-5691100-A SEMICONDUCTORS HOECHST JAPAN LIMITED (JP) 1997-11-25 US claimed
EP-0652483-A1 Lithographic printing plates MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1995-05-10 EP claimed
EP-0633502-A1 PATTERN FORMING MATERIAL HOECHST JAPAN LIMITED (JP) 1995-01-11 EP claimed
US-5372902-A Method for producing color filter NIPPON OIL CO., LTD. (JP) 1994-12-13 US claimed
WO-1992022856-A1 PHOTOELECTROGRAPHIC IMAGING WITH A MULTI-ACTIVE ELEMENT CONTAINING NEAR-INFRARED SENSITIZING PIGMENTS EASTMAN KODAK COMPANY (US) 1992-12-23 WO claimed
US-4994703-A Piezoelectric element of laminate type MITSUBISHI KASEI CORPORATION (JP) 1991-02-19 US claimed
CN-1042925-A The abrasive product that contains the tackiness agent of aminoplast(ic) resin MINNESOTA MINING & MFG (US) 1990-06-13 CN claimed
US-4845011-A BASIFIED ACRIDINE COMPOUND, A TRIAZINE OR QUINAZOLINONE COMPOUND HOECHST CELANESE CORPORATION (US) 1989-07-04 US claimed