Methylene Chloride

Methylene Chloride

SCHEMBL33547

ClCCl.[SiH3]Cl

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120041084-A Organosilicon coating and preparation method and application thereof 广东美的制冷设备有限公司 2025-05-27 CN claimed
CN-120025718-A Composite anti-seepage coating, preparation method thereof and composite anti-seepage coating layer 中国石油化工股份有限公司 2025-05-23 CN claimed
US-8247589-B2 Organic silicon phosphate and fabrication method thereof GRAND TEK ADVANCE MATERIAL SCIENCE CO., LTD. (TW) 2012-08-21 US claimed
US-20110160475-A1 ORGANIC SILICON PHOSPHATE AND FABRICATION METHOD THEREOF GRAND TEK ADVANCE MATERIAL SCIENCE CO., LTD. (TW) 2011-06-30 US claimed
US-20090042999-A1 COMPOSITION FOR POLYURETHANE FOAM, POLYURETHANE FOAM MADE FROM THE COMPOSITION, AND METHOD FOR PREPARING POLYURETHANE FOAM SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-02-12 US claimed
US-20080187661-A1 Diamond particles contain in metal matrix composite; diffusion bonding through interface of silicon carbide; high speed solidification under pressure NANO MATERIALS INTERNATIONAL CORPORATION 2008-08-07 US claimed
JP-2007518875-A 2007-07-12 JP claimed
EP-1680522-A2 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES MATERIALS AND ELECTROCHEMICAL RESEARCH (MER) CORPORATION (US) 2006-07-19 EP claimed
WO-2005035808-A2 HIGH THERMAL CONDUCTIVITY METAL MATRIX COMPOSITES MATERIALS AND ELECTROCHEMICAL RESEARCH (MER) CORPORATION (US) 2005-04-21 WO claimed
US-20050074355-A1 High power electronic packaging; diamond particles dispersed in and chemically bonded to surface of aluminum, copper and/or magnesium metal or alloy NANO MATERIALS INTERNATIONAL CORPORATION 2005-04-07 US claimed
US-5017636-A Also containing polyisoprene, natural rubber, butadiene-styrene copolymer, wear and heat resistance, resilience JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-05-21 US claimed
EP-4673506-A1 BLUISH RED EFFECT PIGMENT Sun Chemical B.V. (NL) 2026-01-07 EP disclosed
CN-120041084-A Organosilicon coating and preparation method and application thereof 广东美的制冷设备有限公司 2025-05-27 CN disclosed
CN-118146703-B Composition for forming back electrode containing conductive polymer and method for manufacturing same 爱帛化学科技有限公司 2025-02-11 CN disclosed
WO-2024180212-A1 BLUISH RED EFFECT PIGMENT SUN CHEMICAL B.V. (NL) 2024-09-06 WO disclosed
EP-0287877-A2 A composite substance and a method for the production of the same Yamamoto, Tohru (JP) 1988-10-26 EP disclosed
US-4766255-A Processes for bisphenols XEROX CORPORATION (US) 1988-08-23 US disclosed
EP-0247884-A2 Magnetic toner CANON KABUSHIKI KAISHA (JP) 1987-12-02 EP disclosed
EP-0245229-A1 Catalytic process for producing silahydrocarbons MONSANTO COMPANY (US) 1987-11-11 EP disclosed
US-4678468-A HEPARIN IN INTERPENETRATING POLYMER NETWORK BIO-MEDICAL CO., LTD. (JP) 1987-07-07 US disclosed