⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27757261 | 0.88 | NPC1 (0.38) | — | |
| SCHEMBL19218148 | 0.86 | — | — | |
| SCHEMBL9914883 | 0.84 | — | — | |
| SCHEMBL9914881 | 0.83 | — | — | |
| SCHEMBL19218146 | 0.78 | — | — | |
| SCHEMBL9915422 | 0.77 | — | — | |
| SCHEMBL19218049 | 0.75 | HTT (0.31) | — | |
| Ethylene Glycol SCHEMBL27888592 | 0.70 | HTT (0.31) | — | |
| SCHEMBL4447476 | 0.70 | — | — | |
| SCHEMBL9062176 | 0.69 | MEN1 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2147942-B1 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION | NITTO DENKO CORP (JP) | 2016-07-06 | — | — | EP | disclosed |
| US-8198382-B2 | Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8198382-B2 | Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2012-06-12 | — | — | US | disclosed |
| US-8198382-B2 | Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same | NITTO DENKO CORPORATION (JP) | 2012-06-12 | — | — | US | disclosed |
| US-20100164127-A1 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME | NITTO DENKO CORPORATION (JP) | 2010-07-01 | — | — | US | disclosed |
| US-20100164127-A1 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME | NITTO DENKO CORPORATION (JP) | 2010-07-01 | — | — | US | disclosed |
| US-20100164127-A1 | EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION AND CURED PRODUCT THEREOF, AND PHOTOSEMICONDUCTOR DEVICE USING THE SAME | NITTO DENKO CORPORATION (JP) | 2010-07-01 | — | — | US | disclosed |
| EP-2147942-A1 | EPOXY RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE ENCAPSULATION, CURED BODY THEREOF, AND OPTICAL SEMICONDUCTOR DEVICE USING THE EPOXY RESIN COMPOSITION | Nitto Denko Corporation (JP) | 2010-01-27 | — | — | EP | disclosed |