⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL182451 | 0.82 | — | — | |
| SCHEMBL5024992 | 0.79 | — | — | |
| SCHEMBL5079140 | 0.77 | — | — | |
| SCHEMBL9495368 | 0.74 | — | — | |
| SCHEMBL7168060 | 0.71 | — | — | |
| SCHEMBL5682511 | 0.68 | — | — | |
| SCHEMBL1092021 | 0.67 | — | — | |
| SCHEMBL1091424 | 0.67 | — | — | |
| SCHEMBL17274724 | 0.67 | — | — | |
| SCHEMBL417175 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023183902-A1 | METHODS FOR APPLYING DECORATIVE METAL FILMS ON POLYMERIC SURFACES | VERGASON TECHNOLOGY, INC. (US) | 2023-09-28 | — | — | WO | claimed |
| US-20230304139-A1 | METHODS FOR APPLYING DECORATIVE METAL FILMS ON POLYMERIC SURFACES | VERGASON TECHNOLOGY | 2023-09-28 | — | — | US | claimed |
| CN-112625243-B | Fluorine-containing modified polysiloxane, and preparation method and application thereof | 山东东岳高分子材料有限公司 | 2022-09-02 | — | — | CN | claimed |
| CN-112552516-B | Modified polysiloxane containing fluorine ring bodies, preparation method and application thereof | 山东东岳高分子材料有限公司 | 2022-07-01 | — | — | CN | claimed |
| CN-112625243-A | Fluorine-containing modified polysiloxane, preparation method and application thereof | 山东东岳高分子材料有限公司 | 2021-04-09 | — | — | CN | claimed |
| CN-112552516-A | Modified polysiloxane containing fluorine ring bodies, preparation method and application thereof | 山东东岳高分子材料有限公司 | 2021-03-26 | — | — | CN | claimed |
| US-7704894-B1 | Method of eliminating small bin defects in high throughput TEOS films | NOVELLUS SYSTEMS, INC. (US) | 2010-04-27 | — | — | US | claimed |
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | claimed |
| EP-4681802-A1 | SEPARATION METHOD AND SEPARATION DEVICE | Kogakuin University (JP) | 2026-01-21 | — | — | EP | disclosed |
| US-20250308883-A1 | INTEGRATING NITRIDE STRESS COMPENSATION LAYERS FOR THICK OXIDE WAFER CREATION | TOKYO ELECTRON LIMITED (JP) | 2025-10-02 | — | — | US | disclosed |
| US-20250283221-A1 | CARRIER RING WITH TABS | LAM RES CORP (US) | 2025-09-11 | — | — | US | disclosed |
| US-12338531-B2 | Spatially tunable deposition to compensate within wafer differential bow | LAM RESEARCH CORPORATION (US) | 2025-06-24 | — | — | US | disclosed |
| US-20250118592-A1 | APPARATUSES FOR BACKSIDE WAFER PROCESSING WITH EDGE-ONLY WAFER CONTACT | LAM RESEARCH CORPORATION (US) | 2025-04-10 | — | — | US | disclosed |
| CN-119615129-A | PECVD deposition system for deposition on a selective side of a substrate | 朗姆研究公司 | 2025-03-14 | — | — | CN | disclosed |
| US-20050260420-A1 | Low dielectric materials and methods for making same | VERSUM MATERIALS US, LLC | 2005-11-24 | — | — | US | disclosed |
| US-20050116346-A1 | Low dielectric materials and methods for making same | VERSUM MATERIALS US, LLC | 2005-06-02 | — | — | US | disclosed |
| EP-1464410-A1 | Low dielectric materials and methods for making same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-10-06 | — | — | EP | disclosed |
| WO-2004073048-A2 | APPARATUS AND METHODS FOR FORMING FILMS ON SUBSTRATES | SYMYX TECHNOLOGIES, INC. (US) | 2004-08-26 | — | — | WO | disclosed |
| CN-1497613-A | Low dielectric material and preparation method thereof | — | 2004-05-19 | — | — | CN | disclosed |
| EP-1369907-A2 | Low dielectric materials and methods for making same | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2003-12-10 | — | — | EP | disclosed |