⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL336518 | 1.00 | — | — | |
| SCHEMBL4856960 | 0.86 | — | — | |
| SCHEMBL27552869 | 0.81 | — | — | |
| SCHEMBL9987464 | 0.79 | — | — | |
| SCHEMBL10923136 | 0.76 | — | — | |
| SCHEMBL327107 | 0.75 | — | — | |
| SCHEMBL28928794 | 0.75 | — | — | |
| SCHEMBL29121075 | 0.75 | — | — | |
| Lithium SCHEMBL30463063 | 0.75 | — | — | |
| SCHEMBL29121123 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11021572-B2 | Photosensitive resin composition, cured product of same, interlayer insulating film, surface protective film and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2021-06-01 | — | — | US | disclosed |
| US-20190161580-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT OF SAME, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM AND ELECTRONIC COMPONENT | HD MICROSYSTEMS, LTD. (JP) | 2019-05-30 | — | — | US | disclosed |
| US-8765868-B2 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-07-01 | — | — | US | disclosed |
| US-8097386-B2 | Positive-type photosensitive resin composition, method for producing patterns, and electronic parts | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2012-01-17 | — | — | US | disclosed |
| US-20110027544-A1 | Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2011-02-03 | — | — | US | disclosed |
| US-20100227126-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-09-09 | — | — | US | disclosed |
| US-6960420-B2 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2005-11-01 | — | — | US | disclosed |
| US-20040142275-A1 | Photosensitive resin composition, process for forming relief pattern, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2004-07-22 | — | — | US | disclosed |