Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRM2 | P08172 | 2/20 | 0.32 |
| ▸ | CHRM5 | P08912 | 2/20 | 0.32 |
| ▸ | CHRM3 | P20309 | 2/20 | 0.32 |
| ▸ | CHRM4 | P08173 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Propylene Oxide SCHEMBL1292008 | 0.71 | — | — | |
| Propylene Oxide SCHEMBL65104 | 0.71 | — | — | |
| Propylene Oxide SCHEMBL1078859 | 0.68 | — | — | |
| Propylene Oxide SCHEMBL5090705 | 0.67 | — | — | |
| Propylene Oxide SCHEMBL22660952 | 0.67 | CHRM2 (0.38) | CHRM2CHRM5CHRM3CHRM4 | |
| Propylene Oxide SCHEMBL2484566 | 0.67 | — | — | |
| Propylene Oxide SCHEMBL6349516 | 0.67 | — | — | |
| Propylene Oxide SCHEMBL373917 | 0.67 | — | — | |
| Propylene Oxide SCHEMBL10626893 | 0.67 | — | — | |
| Propylene Oxide SCHEMBL2763033 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8361697-B2 | Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern and process for producing printed circuit board, lead frame, semiconductor package and concavoconvex board | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2013-01-29 | — | — | US | disclosed |
| US-20100297559-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAMINATE, METHOD FOR FORMING RESIST PATTERN AND PROCESS FOR PRODUCING PRINTED CIRCUIT BOARD, LEAD FRAME, SEMICONDUCTOR PACKAGE AND CONCAVOCONVEX BOARD | ASAHI KASEI E-MATERIALS CORPORATION (JP) | 2010-11-25 | — | — | US | disclosed |
| US-20100159691-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE | ASAHI KASEI EMD CORPORATION (JP) | 2010-06-24 | — | — | US | disclosed |