⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3384578 | 0.85 | — | — | |
| SCHEMBL3760905 | 0.82 | — | — | |
| SCHEMBL7691019 | 0.78 | — | — | |
| SCHEMBL3627270 | 0.78 | TSHR (0.34) | — | |
| SCHEMBL3381959 | 0.77 | — | — | |
| SCHEMBL224380 | 0.75 | TSHR (0.32) | — | |
| SCHEMBL3385707 | 0.74 | — | — | |
| SCHEMBL7683800 | 0.74 | — | — | |
| SCHEMBL7683812 | 0.71 | — | — | |
| SCHEMBL3382918 | 0.71 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0991082-B1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK CORP (JP) | 2010-11-24 | — | — | EP | disclosed |
| EP-0953608-B1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK CORP (JP) | 2008-12-24 | — | — | EP | disclosed |
| US-6500535-B1 | FINELY DISPERSED CROSSLINKED TERPOLYMER COMPRISING ALPHA-OLEFIN, CONJUGATED DIENE, AND VINYL AROMATIC MONOMERS | TDK CORPORATION (JP) | 2002-12-31 | — | — | US | disclosed |
| US-20020190818-A1 | High frequency band pass filter | TDK CORPORATION (JP) | 2002-12-19 | — | — | US | disclosed |
| US-6420476-B1 | MOLECULAR WEIGHT CONTROL FOR HEAT RESISTANT LOW DIELECTRIC POLYMER | TDK CORPORATION (JP) | 2002-07-16 | — | — | US | disclosed |
| EP-0991082-A1 | COMPOSITE DIELECTRIC MATERIAL COMPOSITION, AND FILM, SUBSTRATE, ELECTRONIC PARTS AND MOLDINGS THEREFROM | TDK Corporation (JP) | 2000-04-05 | — | — | EP | disclosed |
| EP-0953608-A1 | HEAT-RESISTANT, LOWLY DIELECTRIC HIGH-MOLECULAR MATERIAL, AND FILMS, SUBSTRATES, ELECTRIC COMPONENTS AND HEAT-RESISTANT RESIN MOLDINGS PRODUCED THEREFROM | TDK Corporation (JP) | 1999-11-03 | — | — | EP | disclosed |
| EP-0295821-B1 | Method for production of graft resin composition | NIPPON OILS & FATS CO LTD (JP) | 1994-01-05 | — | — | EP | disclosed |
| US-4839423-A | USING A UNSATURATED ORGANIC PEROXY FREE RADICAL CATALYSY | NIPPON OIL & FATS CO., LTD. (JP) | 1989-06-13 | — | — | US | disclosed |
| EP-0295821-A2 | Method for production of graft resin composition | NIPPON OIL AND FATS COMPANY, LIMITED (JP) | 1988-12-21 | — | — | EP | disclosed |