SCHEMBL338451

SCHEMBL338451

[PbH2].[Ti]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28161729 0.82
SCHEMBL28286054 0.82
Water SCHEMBL19436365 0.82
Water SCHEMBL3700386 0.82
Hydrochloric Acid SCHEMBL29197830 0.82
SCHEMBL1828465 0.82
Methane SCHEMBL17812131 0.82
SCHEMBL7258940 0.82
Water SCHEMBL21273331 0.82
SCHEMBL28043416 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 824 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250357910-A1 RESONATOR AND METHOD FOR FORMING THE SAME AAC TECHNOLOGIES PTE LTD (SG) 2025-11-20 US claimed
US-20250349974-A1 SEPARATOR, METHOD FOR PREPARING THE SAME, AND SECONDARY BATTERY AND ELECTRICAL DEVICE RELATED THERETO CONTEMPORARY AMPEREX TECHNOLOGY HONG KONG LTD (CN) 2025-11-13 US claimed
EP-4641805-A1 SEPARATOR, PREPARATION METHOD THEREFOR, AND SECONDARY BATTERY AND ELECTRIC DEVICE RELATED THERETO Contemporary Amperex Technology (Hong Kong) Limited (HK) 2025-10-29 EP claimed
US-12311407-B2 Inertization of material surfaces by functionalized perfluorinated molecules TECHNISCHE UNIVERSITAT BERLIN (DE) 2025-05-27 US claimed
CN-118676123-B Packaging module for packaging wafer in outer space and packaging method thereof 深圳市安信达存储技术有限公司 2025-01-28 CN claimed
CN-119325666-A Separator, method for producing the same, and secondary battery and electric device using the same 宁德时代新能源科技股份有限公司 2025-01-17 CN claimed
CN-118676123-A Packaging module for packaging wafer in outer space and packaging method thereof 深圳市安信达存储技术有限公司 2024-09-20 CN claimed
CN-118631211-A Resonator and preparation method thereof 瑞声科技(新加坡)有限公司 2024-09-10 CN claimed
WO-2024168448-A1 SEPARATOR, PREPARATION METHOD THEREFOR, AND SECONDARY BATTERY AND ELECTRIC DEVICE RELATED THERETO 宁德时代新能源科技股份有限公司 2024-08-22 WO claimed
US-20240267018-A1 PIEZOELECTRIC FILM BULK ACOUSTIC RESONATOR AAC TECHNOLOGIES (NANJING) CO., LTD. (CN) 2024-08-08 US claimed
EP-0415428-B1 Powder composition for sintering into modified barium titanate semiconductive ceramic CENTRAL GLASS CO LTD (JP) 1994-06-08 EP claimed
CN-2144866-Y Sealing type colloid storage battery ZHOU LIANCAI (CN) 1993-10-27 CN claimed
EP-0550759-A1 DISCHARGE TUBE FOR LASER FANUC LTD. (JP) 1993-07-14 EP claimed
US-5219811-A Powder composition for sintering into modified barium titanate semiconductive ceramic CENTRAL GLASS COMPANY, LIMITED (JP) 1993-06-15 US claimed
EP-0281220-B1 COMPOSITE SUBSTRATE FOR INTEGRATED CIRCUITS Corning Glass Works (US) 1992-08-26 EP claimed
EP-0415428-A1 Powder composition for sintering into modified barium titanate semiconductive ceramic CENTRAL GLASS COMPANY, LIMITED (JP) 1991-03-06 EP claimed
US-4775596-A FOR PACKAGING ELECTRONIC COMPONENTS; BOROSILICATE GLASS AND CERAMIC BONDING, LAMINATION CORNING GLASS WORKS (US) 1988-10-04 US claimed
EP-0281220-A1 Composite substrate for integrated circuits Corning Glass Works (US) 1988-09-07 EP claimed
EP-0098149-B1 POROUS BODY FOR ELECTROLYTIC CAPACITOR HAVING A LEAD WIRE AND METHOD OF PRODUCING THE SAME NEC CORPORATION (JP) 1988-03-30 EP claimed
EP-0098149-A2 Porous body for electrolytic capacitor having a lead wire and method of producing the same NEC CORPORATION (JP) 1984-01-11 EP claimed