Methoxyacetic Acid

Methoxyacetic Acid

SCHEMBL338718

COCC(=O)[O-].COCC(=O)[O-].COCC(=O)[O-].[Bi+3]

nearest known ligand 0.42

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

HRH2

The experimentally established mechanism targets of Methoxyacetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.37
FFAR3 O14843 2/20 0.36
HDAC3 O15379 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
HDAC8 Q9BY41 2/20 0.36
CA1 P00915 5/20 0.33
CASP1 P29466 1/20 0.33
CA2 P00918 1/20 0.33
CYP2C19 P33261 1/20 0.32
NPSR1 Q6W5P4 1/20 0.32
TSHR P16473 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Methoxyacetic Acid SCHEMBL5050299 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL4409509 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL18169478 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL5860341 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL4408238 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL3796356 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL5903057 0.94
Methoxyacetic Acid SCHEMBL630881 0.94
Methoxyacetic Acid SCHEMBL5859205 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2
Methoxyacetic Acid SCHEMBL11767030 0.94 CA4 (0.37) CA4FFAR3HDAC3HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20090169903-A1 PROCESS FOR PRODUCING METAL SUBSTRATE WITH MULTILAYER FILM, METAL SUBSTRATE WITH MULTILAYER FILM OBTAINED BY THE PROCESS, AND COATED ARTICLE KANSAI PAINT CO., LTD. (JP) 2009-07-02 US claimed
EP-1000985-B1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION KANSAI PAINT CO LTD (JP) 2007-02-14 EP claimed
US-6265079-B1 RESIN CONTAINING BISMUTH LACTATE OR METHOXYACETATE KANSAI PAINT CO., LTD. (JP) 2001-07-24 US claimed
EP-1000985-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 2000-05-17 EP claimed
US-20240384116-A1 MODIFIED EPOXY RESIN AND ELECTRODEPOSITION COATING MATERIAL KANSAI PAINT CO., LTD. (JP) 2024-11-21 US disclosed
CN-115362193-B Epoxy resin and electrodeposition paint 关西涂料株式会社 2024-11-08 CN disclosed
EP-4410858-A1 MODIFIED EPOXY RESIN AND ELECTRODEPOSITION COATING MATERIAL Kansai Paint Co., Ltd. (JP) 2024-08-07 EP disclosed
CN-118103424-A Modified epoxy resin and electrodeposition paint 关西涂料株式会社 2024-05-28 CN disclosed
US-20230134156-A1 EPOXY RESIN AND ELECTRODEPOSITION PAINT KANSAI PAINT CO., LTD. (JP) 2023-05-04 US disclosed
EP-4130089-A1 EPOXY RESIN AND ELECTRODEPOSITION COATING Kansai Paint Co., Ltd (JP) 2023-02-08 EP disclosed
CN-115362193-A Epoxy resin and electrodeposition paint 关西涂料株式会社 2022-11-18 CN disclosed
US-20220154014-A1 CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION KANSAI PAINT CO., LTD. (JP) 2022-05-19 US disclosed
US-20040146716-A1 Cathodic electrodeposition coating compositions containing bismuth compounds and dicarboxylic acids, production and use thereof E. I. DU PONT DE NEMOURS AND COMPANY 2004-07-29 US disclosed
US-20040050704-A1 Electrodeposition baths containing metal salts and methods related thereto PPG INDUSTRIES OHIO, INC. 2004-03-18 US disclosed
WO-2004000955-A1 ELECTRODEPOSITION BATHS CONTAINING METAL SALTS AND METHODS RELATED THERETO PPG INDUSTRIES OHIO, INC. (US) 2003-12-31 WO disclosed
US-6265079-B1 RESIN CONTAINING BISMUTH LACTATE OR METHOXYACETATE KANSAI PAINT CO., LTD. (JP) 2001-07-24 US disclosed
US-6265079-B1 RESIN CONTAINING BISMUTH LACTATE OR METHOXYACETATE KANSAI PAINT CO., LTD. (JP) 2001-07-24 US disclosed
EP-1000985-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 2000-05-17 EP disclosed
EP-1000985-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 2000-05-17 EP disclosed
WO-1999006493-A1 CATIONIC ELECTRODEPOSITION COATING COMPOSITION KANSAI PAINT CO., LTD. (JP) 1999-02-11 WO disclosed