Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | NR4A1 | P22736 | 1/20 | 0.53 |
| ▸ | NR4A2 | P43354 | 1/20 | 0.53 |
| ▸ | NR4A3 | Q92570 | 1/20 | 0.53 |
| ▸ | HPGD | P15428 | 4/20 | 0.53 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.53 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.53 |
| ▸ | THRB | P10828 | 1/20 | 0.53 |
| ▸ | TSHR | P16473 | 1/20 | 0.53 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.53 |
| ▸ | ATIC | P31939 | 1/20 | 0.53 |
| ▸ | SELL | P14151 | 1/20 | 0.52 |
| ▸ | SELP | P16109 | 1/20 | 0.52 |
| ▸ | LCK | P06239 | 1/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | HMGB1 | P09429 | 2/20 | 0.48 |
| ▸ | CA12 | O43570 | 1/20 | 0.48 |
| ▸ | CA1 | P00915 | 1/20 | 0.48 |
| ▸ | CA2 | P00918 | 1/20 | 0.48 |
| ▸ | CA4 | P22748 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30388521 | 0.84 | NR4A1 (0.53) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL10012443 | 0.83 | NR4A1 (0.67) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL11857852 | 0.83 | NR4A1 (0.67) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL27985 | 0.82 | NR4A1 (0.73) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL29406795 | 0.82 | NR4A1 (0.73) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL3239130 | 0.82 | CA12 (0.54) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| Naphthoic Acid SCHEMBL27945984 | 0.82 | NR4A1 (0.72) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL14595553 | 0.81 | SELL (0.71) | HPGDHSD17B10CYP2C9THRBTSHR | |
| SCHEMBL29690401 | 0.81 | CDC25B (0.62) | NR4A1NR4A2NR4A3HPGDHSD17B10 | |
| SCHEMBL187810 | 0.81 | CDC25B (0.62) | NR4A1NR4A2NR4A3HPGDHSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117247319-A | 5, 6-dihydroxynaphthoate compound and preparation method and application thereof | 中国药科大学 | 2023-12-19 | — | — | CN | claimed |
| CN-117247319-A | 5, 6-dihydroxynaphthoate compound and preparation method and application thereof | 中国药科大学 | 2023-12-19 | — | — | CN | disclosed |
| CN-117247319-A | 5, 6-dihydroxynaphthoate compound and preparation method and application thereof | 中国药科大学 | 2023-12-19 | — | — | CN | disclosed |
| CN-117247319-A | 5, 6-dihydroxynaphthoate compound and preparation method and application thereof | 中国药科大学 | 2023-12-19 | — | — | CN | disclosed |
| US-20230296984-A1 | EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| US-20230296984-A1 | EUV RESIST UNDERLAYER FILM-FORMING COMPOSITION | NISSAN CHEMICAL CORPORATION (JP) | 2023-09-21 | — | — | US | disclosed |
| EP-3230339-B1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES (JP) | 2022-03-23 | — | — | EP | disclosed |
| US-20210397090-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION AND METHOD FOR FORMING RESIST PATTERN USING THE SAME | NISSAN CHEMICAL CORPORATION (JP) | 2021-12-23 | — | — | US | disclosed |
| CN-107001594-B | Composition epoxy resin, prepreg, the manufacturing method of fiber reinforced plastic materials and fiber reinforced plastic materials | 东丽株式会社 | 2019-07-23 | — | — | CN | disclosed |
| US-20170362376-A1 | EPOXY RESIN COMPOSITION, PREPREG, FIBER-REINFORCED PLASTIC MATERIAL, AND MANUFACTURING METHOD FOR FIBER-REINFORCED PLASTIC MATERIAL | TORAY INDUSTRIES, INC. (JP) | 2017-12-21 | — | — | US | disclosed |
| CN-102574988-B | Composition for formation of cured epoxy resin, and cured products thereof | NIPPON SODA CO | 2014-05-14 | — | — | CN | disclosed |
| US-8653160-B2 | Inclusion complex containing epoxy resin composition for semiconductor encapsulation | NIPPON SODA CO., LTD. (JP) | 2014-02-18 | — | — | US | disclosed |
| EP-2573148-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | Nippon Soda Co., Ltd. (JP) | 2013-03-27 | — | — | EP | disclosed |
| US-20130059942-A1 | CURABLE POWDER COATING COMPOSITION, AND CURED PRODUCT OF SAME | NIPPON SODA CO., LTD. (JP) | 2013-03-07 | — | — | US | disclosed |
| CN-102892849-A | Curable powder coating composition and cured product thereof | NIPPON SODA CO | 2013-01-23 | — | — | CN | disclosed |
| EP-2489689-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | Nippon Soda Co., Ltd. (JP) | 2012-08-22 | — | — | EP | disclosed |
| US-20120196991-A1 | COMPOSITION FOR FORMATION OF CURED EPOXY RESIN, AND CURED PRODUCTS THEREOF | NISSO CHEMICAL ANALYSIS SERVICE CO., LTD. (JP) | 2012-08-02 | — | — | US | disclosed |
| CN-101802049-A | Epoxy resin composition for semiconductor encapsulation containing inclusion complex | NIPPON SODA CO | 2010-08-11 | — | — | CN | disclosed |
| US-20100179250-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | NIPPON SODA CO., LTD. (JP) | 2010-07-15 | — | — | US | disclosed |
| EP-2192139-A1 | INCLUSION COMPLEX CONTAINING EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION | Nippon Soda Co., Ltd. (JP) | 2010-06-02 | — | — | EP | disclosed |