SCHEMBL3390093

SCHEMBL3390093

CCCCCCCCCCCCC[N+](C)(C)C(C)(CC)C(=O)[O-]

nearest known ligand 0.43

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.43
DNM1 Q05193 12/20 0.42
LSS P48449 1/20 0.41
KMT2A Q03164 1/20 0.41
HSP90AA1 P07900 1/20 0.39
RAD52 P43351 1/20 0.39
CA2 P00918 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18139069 0.88 HTT (0.42) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL18140859 0.88 HTT (0.42) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL7892633 0.88 HTT (0.42) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL94004 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL18140571 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL79955 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL94469 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL607638 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL7899851 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1
SCHEMBL18139829 0.81 HTT (0.46) HTTDNM1LSSKMT2AHSP90AA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2612653-B1 COMPOSITION FOR CLEANING SCALP AND HEAD HAIR OTSUKA PHARMA CO LTD (JP) 2017-10-11 EP disclosed
US-9496218-B2 Integrated circuit device having through-silicon-via structure SAMSUNG ELECTRONICS CO., LTD. (KR) 2016-11-15 US disclosed
US-9062137-B2 Block copolymer and antistatic agent comprising same TOHO CHEMICAL INDUSTRY CO., LTD. (JP) 2015-06-23 US disclosed
US-8742017-B2 Antistatic agent and resin composition containing same TOHO CHEMICAL INDUSTRY CO., LTD. (JP) 2014-06-03 US disclosed
US-20140021633-A1 Integrated Circuit Device Having Through-Silicon-Via Structure and Method of Manufacturing the Same SAMSUNG ELECTRONICS CO., LTD. (KR) 2014-01-23 US disclosed
US-20130216491-A1 COMPOSITION FOR CLEANING SCALP AND HEAD HAIR OTSUKA PHARMACEUTICAL CO., LTD. (JP) 2013-08-22 US disclosed
EP-2612653-A1 COMPOSITION FOR CLEANING SCALP AND HEAD HAIR Otsuka Pharmaceutical Co., Ltd. (JP) 2013-07-10 EP disclosed
US-20130123434-A1 BLOCK COPOLYMER AND ANTISTATIC AGENT COMPRISING SAME TOHO CHEMICAL INDUSTRY CO., LTD. (JP) 2013-05-16 US disclosed
US-20120283386-A1 ANTISTATIC AGENT AND RESIN COMPOSITION CONTAINING SAME TOHO CHEMICAL INDUSTRY CO., LTD. (JP) 2012-11-08 US disclosed
US-20100084277-A1 Composition for copper plating and associated methods SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-04-08 US disclosed