SCHEMBL339030

SCHEMBL339030

C=CC(C)O[SiH](CC)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6064201 0.81
SCHEMBL4622908 0.73
SCHEMBL6064077 0.71
SCHEMBL6062851 0.70
SCHEMBL340551 0.70
SCHEMBL13089024 0.69
SCHEMBL9494575 0.69
SCHEMBL2590667 0.69
SCHEMBL6063943 0.69 TSHR (0.33)
SCHEMBL673887 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106800655-A A kind of organic silicon rigidity-increasing stick and preparation method thereof and a kind of silica-gel composition 比亚迪股份有限公司 2017-06-06 CN claimed
CN-105492539-B Curable organosilicon composition, its cured product and optical semiconductor device 美国陶氏有机硅公司 2019-05-07 CN disclosed
US-9994681-B2 Organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same HENKEL AG & CO. KGAA (DE) 2018-06-12 US disclosed
EP-3245256-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME Henkel AG & Co. KGaA (DE) 2017-11-22 EP disclosed
US-20170306100-A1 Organopolysiloxane Prepolymer and a Curable Organopolysiloxane Composition Comprising the Same HENKEL CORPORATION 2017-10-26 US disclosed
CN-106800655-A A kind of organic silicon rigidity-increasing stick and preparation method thereof and a kind of silica-gel composition 比亚迪股份有限公司 2017-06-06 CN disclosed
CN-105960438-A Curable silicon composition, cured product thereof, and optical semiconductor device 道康宁东丽株式会社 2016-09-21 CN disclosed
WO-2016112487-A1 ORGANOPOLYSILOXANE PREPOLYMER AND CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING SAME HENKEL (CHINA) COMPANY LIMITED (CN) 2016-07-21 WO disclosed
WO-2016054781-A1 AN ORGANOPOLYSILOXANE PREPOLYMER AND A CURABLE ORGANOPOLYSILOXANE COMPOSITION COMPRISING THE SAME HENKEL (CHINA) COMPANY LIMITED (CN) 2016-04-14 WO disclosed
CN-105492539-A Curable silicone composition, cured product thereof, and optical semiconductor device DOW CORNING 2016-04-13 CN disclosed
CN-104812841-A Curable silicone composition, cured product thereof, and optical semiconductor device DOW CORNING TORAY CO LTD 2015-07-29 CN disclosed
CN-104812856-A Organopolysiloxane, curable silicone composition, cured product thereof, and optical semiconductor device DOW CORNING TORAY CO LTD 2015-07-29 CN disclosed
EP-2065455-B1 Pressure-sensitive adhesive tape NITTO DENKO CORP (JP) 2012-05-16 EP disclosed
US-20120015100-A1 Pressure-Sensitive Adhesive Tape NITTO DENKO CORPORATION (JP) 2012-01-19 US disclosed
EP-2383321-A2 Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process Nitto Denko Corporation (JP) 2011-11-02 EP disclosed
US-20090142593-A1 PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2009-06-04 US disclosed
EP-2065455-A1 Pressure-sensitive adhesive tape NITTO DENKO CORPORATION (JP) 2009-06-03 EP disclosed
US-7015292-B2 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2006-03-21 US disclosed
US-20050038214-A1 Silicon-containing olefin copolymer, crosslinkable rubber composition thereof, and use thereof MITSUI CHEMICALS, INC. (JP) 2005-02-17 US disclosed