SCHEMBL340022

SCHEMBL340022

[Al+3].[Al+3].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[O-2].[SiH4].[SiH4].[Zr+4].[Zr+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30121253 0.87
SCHEMBL8677689 0.87
SCHEMBL557584 0.87
SCHEMBL144868 0.87
SCHEMBL11624191 0.87
SCHEMBL640748 0.87
SCHEMBL8629754 0.87
SCHEMBL3370957 0.87
SCHEMBL704780 0.87
SCHEMBL29520317 0.87

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 53 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8008700-B2 Non-volatile memory cell with embedded antifuse SANDISK 3D LLC (US) 2011-08-30 US claimed
US-7830697-B2 High forward current diodes for reverse write 3D cell SANDISK 3D LLC (US) 2010-11-09 US claimed
JP-2010531543-A 2010-09-24 JP claimed
WO-2010059672-A1 INTEGRATION OF DAMASCENE TYPE DIODES AND CONDUCTIVE WIRES FOR MEMORY DEVICE SANDISK 3D LLC (US) 2010-05-27 WO claimed
US-20100127358-A1 Integration of damascene type diodes and conductive wires for memory device SANDISK 3D LLC 2010-05-27 US claimed
EP-2165336-A1 HIGH FORWARD CURRENT DIODES FOR REVERSE WRITE 3D CELL AND METHOD OF MAKING THEREOF Sandisk 3D LLC (US) 2010-03-24 EP claimed
US-7684226-B2 Method of making high forward current diodes for reverse write 3D cell SANDISK 3D LLC (US) 2010-03-23 US claimed
WO-2009002477-A1 HIGH FORWARD CURRENT DIODES FOR REVERSE WRITE 3D CELL AND METHOD OF MAKING THEREOF SANDISK 3D LLC (US) 2008-12-31 WO claimed
US-20080316809-A1 High forward current diodes for reverse write 3D cell SANDISK 3D LLC 2008-12-25 US claimed
US-20080316796-A1 Method of making high forward current diodes for reverse write 3D cell SANDISK 3D LLC 2008-12-25 US claimed
US-20080017912-A1 Non-volatile memory cell with embedded antifuse SANDISK 3D LLC 2008-01-24 US claimed
US-10586593-B2 Programmable resistive device and memory using diode as selector ATTOPSEMI TECHNOLOGY CO., LTD (TW) 2020-03-10 US disclosed
US-20180075906-A1 PROGRAMMABLE RESISTIVE DEVICE AND MEMORY USING DIODE AS SELECTOR ATTOPSEMI TECH CO LTD (TW) 2018-03-15 US disclosed
US-9818478-B2 Programmable resistive device and memory using diode as selector ATTOPSEMI TECHNOLOGY CO., LTD (TW) 2017-11-14 US disclosed
US-20140160830-A1 Programmable Resistive Device and Memory Using Diode as Selector ATTOPSEMI TECHNOLOGY CO., LTD (TW) 2014-06-12 US disclosed
WO-2009002477-A1 HIGH FORWARD CURRENT DIODES FOR REVERSE WRITE 3D CELL AND METHOD OF MAKING THEREOF SANDISK 3D LLC (US) 2008-12-31 WO disclosed
US-20080316809-A1 High forward current diodes for reverse write 3D cell SANDISK 3D LLC 2008-12-25 US disclosed
US-20080316796-A1 Method of making high forward current diodes for reverse write 3D cell SANDISK 3D LLC 2008-12-25 US disclosed
US-20080017912-A1 Non-volatile memory cell with embedded antifuse SANDISK 3D LLC 2008-01-24 US disclosed
US-20080013364-A1 Method of making non-volatile memory cell with embedded antifuse SANDISK 3D LLC 2008-01-17 US disclosed