⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ammonia Solution, Strong SCHEMBL28654585 | 0.97 | — | — | |
| SCHEMBL22534472 | 0.92 | — | — | |
| SCHEMBL5050420 | 0.89 | SMPD1 (0.30) | — | |
| SCHEMBL340981 | 0.81 | — | — | |
| SCHEMBL1426982 | 0.81 | — | — | |
| SCHEMBL6298010 | 0.81 | SMPD1 (0.32) | — | |
| SCHEMBL7934687 | 0.78 | SMPD1 (0.36) | — | |
| SCHEMBL7934735 | 0.78 | SMPD1 (0.36) | — | |
| SCHEMBL7936797 | 0.78 | SMPD1 (0.36) | — | |
| SCHEMBL5160133 | 0.78 | SMPD1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102959004-B | Acrylic rubber composition, vulcanizate, hose part, and sealing part | DENKI KAGAKU KOGYO KK | 2015-06-17 | — | — | CN | disclosed |
| US-8377626-B2 | Methods of forming a pattern using negative-type photoresist compositions | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2013-02-19 | — | — | US | disclosed |
| EP-2065455-B1 | Pressure-sensitive adhesive tape | NITTO DENKO CORP (JP) | 2012-05-16 | — | — | EP | disclosed |
| US-20120015100-A1 | Pressure-Sensitive Adhesive Tape | NITTO DENKO CORPORATION (JP) | 2012-01-19 | — | — | US | disclosed |
| EP-2383321-A2 | Process for producing an adhesive composition and adhesive tape comprising an adhesive composition produced by said process | Nitto Denko Corporation (JP) | 2011-11-02 | — | — | EP | disclosed |
| US-20100248134-A1 | Methods of forming a pattern using negative-type photoresist compositions | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-09-30 | — | — | US | disclosed |
| US-20090142593-A1 | PRESSURE-SENSITIVE ADHESIVE TAPE | NITTO DENKO CORPORATION (JP) | 2009-06-04 | — | — | US | disclosed |
| EP-2065455-A1 | Pressure-sensitive adhesive tape | NITTO DENKO CORPORATION (JP) | 2009-06-03 | — | — | EP | disclosed |
| EP-0604677-B1 | Method of making coated shaped articles | MITSUBISHI RAYON CO (JP) | 1999-08-11 | — | — | EP | disclosed |
| US-5470616-A | Coated shaped articles and method of making same | MITSUBISHI RAYON CO., LTD. (JP) | 1995-11-28 | — | — | US | disclosed |
| EP-0604677-A1 | Coated shaped articles and method of making same | MITSUBISHI RAYON CO., LTD. (JP) | 1994-07-06 | — | — | EP | disclosed |