SCHEMBL341198

SCHEMBL341198

CC=C(C)C(=O)OC1CCCC1

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 2/20 0.42
NAAA Q02083 2/20 0.40
HTT P42858 2/20 0.38
CA12 O43570 2/20 0.37
CA1 P00915 2/20 0.37
CA2 P00918 2/20 0.37
CA9 Q16790 2/20 0.37
CYP2C19 P33261 1/20 0.36
CYP19A1 P11511 4/20 0.34
MAPT P10636 1/20 0.34
GPR35 Q9HC97 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10605789 1.00 EPHX1 (0.42) EPHX1NAAAHTTCA12CA1
SCHEMBL1048430 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
SCHEMBL17159433 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
SCHEMBL6834995 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
SCHEMBL10602595 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
SCHEMBL25410637 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
SCHEMBL334029 0.98 EPHX1 (0.46) EPHX1NAAAHTTCA12CA1
Water SCHEMBL28218882 0.96 EPHX1 (0.44) EPHX1NAAAHTTCA12CA1
SCHEMBL4117455 0.95 EPHX1 (0.38) EPHX1NAAAHTTCA12CA1
SCHEMBL10645483 0.92 TSHR (0.39) EPHX1NAAAHTTCA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12017950-B2 Low-E glass plate, protective sheet for low-E glass plate and use thereof NITTO DENKO CORPORATION (JP) 2024-06-25 US disclosed
WO-2024106384-A1 ADHESIVE SHEET MANUFACTURING METHOD 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106387-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106390-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106388-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106220-A1 RESIN FOR ACTIVE ENERGY RAY CURABLE INK, COMPOSITION FOR ACTIVE ENERGY RAY CURABLE INK, INK COMPOSITION, AND PRINTED MATERIAL DICグラフィックス株式会社 2024-05-23 WO disclosed
WO-2024106389-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106385-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024106386-A1 ADHESIVE SHEET 日東電工株式会社 2024-05-23 WO disclosed
WO-2024101424-A1 ADHESIVE BODY 日東電工株式会社 2024-05-16 WO disclosed
US-20030180578-A1 Magnetic recording medium FUJI PHOTO FILM CO., LTD. 2003-09-25 US disclosed
EP-1324135-A1 ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION Goo Chemical Co., Ltd. (JP) 2003-07-02 EP disclosed
US-20030096139-A1 Magnetic recording medium FUJI PHOTO FILM CO., LTD. 2003-05-22 US disclosed
US-6465540-B1 POLYMER CONTAINING EPOXIZED ETHYLENICALLY UNSATURATE, DIACRY-LATED POLYETHER AND POLYBASIC ANHYDRIDE WITH SUCH AS A CRESOL NOVOLAC EPOXY RESIN AND PHOTOINITIATOR; DILUTE ALKALI DEVE-LOPABLE; PROTECTIVE FILMS FOR COLOR FILTERS; PRINTED CIRCUITS GOO CHEMICAL CO., LTD. (JP) 2002-10-15 US disclosed
US-6432612-B1 ADDITION-CONDENSATION COPOLYMER GOO CHEMICAL CO., LTD. (JP) 2002-08-13 US disclosed
EP-1037111-A1 Ultraviolet curable resin composition and photo solder resist ink using the same Goo Chemical Co., Ltd. (JP) 2000-09-20 EP disclosed
CN-1205454-A Photosensitive resin compsns. and display components using same CHISSO CORP (JP) 1999-01-20 CN disclosed
EP-0112394-B1 PROCESS FOR PREPARING ANGELIC ACID OR ITS ESTER TORAY INDUSTRIES, INC. (JP) 1989-11-02 EP disclosed
US-4613680-A ISOMERIZATION TORAY INDUSTRIES, INC. (JP) 1986-09-23 US disclosed
EP-0112394-A1 PROCESS FOR PREPARING ANGELIC ACID OR ITS ESTER TORAY INDUSTRIES, INC. (JP) 1984-07-04 EP disclosed